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Wireless communicating nodes at 60 GHz integrated on flexible substrate for short-distance instrumentation in aeronautics and space

Published online by Cambridge University Press:  17 November 2011

Mohamed Mehdi Jatlaoui ,
Daniela Dragomirescu ,
Mariano Ercoli ,
Michael Krämer ,
Samuel Charlot ,
Patrick Pons ,
Hervé Aubert  and
Robert Plana
Mohamed Mehdi Jatlaoui*
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Daniela Dragomirescu
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Mariano Ercoli
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Michael Krämer
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Samuel Charlot
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Patrick Pons
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Hervé Aubert
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
Robert Plana
Affiliation:
CNRS, LAAS, 7, avenue du Colonel Roche, F-31077 Toulouse, France. Phone: +33 561336817. University of Toulouse, UPS, INSA, INP, ISAE, LAAS, F-31077 Toulouse, France.
*
Corresponding author: M. M. Jatlaoui Email: jatlaoui@laas.fr
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Abstract

This paper presents the research done at LAAS-CNRS and in the context of “NANOCOMM” project. This project aims to demonstrate the potential of nanotechnology for the development of reconfigurable, ultra-sensitive, low consumption, and easy installation sensor networks with high performance in terms of reliability in line with the requirements of aeronautics and space. Each node of the sensor network is composed of nano-sensors, transceiver, and planar antenna. In this project, three-dimensional (3D) heterogeneous integration of these different components, on flexible polyimide substrate, is planned. Two types of sensors are selected for this project: strain gauges are used for the structure health monitoring (SHM) application and electrochemical cells are used to demonstrate the ability to detect frost phenomenon. After processing, sensors data are processed and transmitted to the reader unit using an ultra-wide band (UWB) transceiver. (digital baseband and radiofrequency (RF) head). The design and implementation of reconfigurable wireless communication architectures are provided according to the application requirements using nanoscale 65 nm CMOS technology. It is proposed to integrate on flexible substrate the transceiver using the flip-chip technique. A 60 GHz planar antenna is connected to the transceiver for the wireless data transmission. This paper is focused on the 3D integration techniques and the technological process used for the realization of such communicating nano-objects on polyimide substrate. The first assembly tests were carried out. Tests of interconnections quality and electrical contacts (Daisy Chain, calibration kit, etc.) were also performed with good results. A bumps contact resistance of 15 mΩ is measured.

Keywords

Flexible electronics at 60GHz3D Heterogeneous integration60GHz UWB communicationFlexible substrateFlex assemblyWireless sensor networks
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 4 , Special Issue 1: IJMWT Special Issue on the 2011 National Microwave Days in France , February 2012 , pp. 109 - 117
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2011

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References

REFERENCES

[1]Stolz, C.; Neumer, M.: Structural health monitoring, in-service experience, benefit and way ahead, in Proc. Int. Workshop on Structural Health Monitoring, Stanford, USA, September 2009, 59–74.Google Scholar
[2]Young, J.; Haugse, E.; Davis, C.: Structural health management an evolution in design, in Int. Workshop on Structural Health Monitoring, Stanford, USA, September 2009, 3–13.Google Scholar
[3]Ressier, L.; Palleau, E.; Garcia, C.; Viau, G.; Viallet, B.: How to control AFM nanoxerography for the template monolayered self-assembly of 2 nm colloidal gold nanparticules. IEEE Trans. Nanotechnol., 4 ( 2009), 487–491.CrossRefGoogle Scholar
[4]Temple Boyer, P.; Benyahia, A.; Sant, W.; Pourciel-Gouzy, M.L.; Launay, J.; Martinez, A.: Modelling of urea-EnFETs for haemodialysis applications. Sensors Actuators, 131 (2) (2008), 525–532.CrossRefGoogle Scholar
[5]Kramer, M.; Dragomirescu, D.; Plana, R.: Design of a very low-power, low-cost 60 GHz receiver front-end implemented in 65 nm CMOS technology. Int. J. Microw. Wireless Technol., 3 (2) (2011), 131–138.CrossRefGoogle Scholar
[6]Kraemer, M.; Dragomirescu, D.; Plana, R.: A high efficiency differential 60 GHz VCO in a 65 nm CMOS technology for WSN applications. IEEE Microw. Wireless Compon. Lett., 99 ( 2011), 314–316.CrossRefGoogle Scholar
[7]Ercoli, M.; Kramer, M.; Dragomirescu, D.; Plana, R.: A high performance integrated balun for 60 GHz application in 65 nm CMOS technology, in Proc. Asia Pacific Microwave Conf. (APMC 2010), Yokohama (Japan), 7–10 Decemer 2010, 1845–1848.Google Scholar
[8]Riley, G.A.: Introduction to flip chip: what, why, how. http://www.flipchips.com, October 2000.Google Scholar
[9]Kramer, M.; Dragomirescu, D.; Plana, R.: A low-power high-gain LNA for the 60 GHz band in 65 nm CMOS technology, in Proc. Asia Pacific Microwave Conf. (APMC 2009), Singapore, December 2009, 1156–1159.Google Scholar