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Improving sol-gel Yba2Cu3O7−δ film morphology using high-boiling-point solvents

Published online by Cambridge University Press:  31 January 2011

J. T. Dawley ,
P. G. Clem ,
M. P. Siegal ,
D. R. Tallant  and
D. L. Overmyer
J. T. Dawley
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
P. G. Clem
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
M. P. Siegal
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
D. R. Tallant
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
D. L. Overmyer
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
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Abstract

The effect of high-boiling-point solvent addition on the morphology of low-p(O2) processed, sol-gel YBa2Cu3O7−δ (YBCO) films is discussed. Proper selection and addition of a high-boiling-point solvent prevents film roughening during precursor pyrolysis, while permitting at least a tenfold reduction in pyrolysis time compared to standard film processing in air or O2. Use of such solvents appears to increase film plasticity, avoiding elastic compressive stress related buckling. High-quality YBCO films on 〈100〉 LaAlO3 with a critical current density (Jc) ∼ 3–4 MA/cm2 at 77 K, are routinely crystallized with this new sol-gel process. Diethanolamine-based, sol-gel YBCO films deposited on sol-gel SrTiO3-buffered 〈100〉 Ni have Jc(77 K) > 1 MA/cm2, demonstrating a route toward all-sol-gel superconducting wires.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 17 , Issue 8 , August 2002 , pp. 1900 - 1903
Copyright
Copyright © Materials Research Society 2002

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