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Thermal treatment effects on hard and soft films measured by nanoindentation test

Published online by Cambridge University Press:  31 January 2011

F.C. Tai*
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
S.C. Lee
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan
C. Wei
Affiliation:
Department of Mechanical Engineering, Tatung University, Taipei 104, Taiwan
P.J. Wei
Affiliation:
Department of Mechanical Engineering, National Cheng-Kung University, Tainan 701, Taiwan
J.F. Lin
Affiliation:
Department of Mechanical Engineering, National Cheng-Kung University, Tainan 701, Taiwan
*
a) Address all correspondence to this author. e-mail: fctai2008@gmail.com
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Abstract

Nanoindentation measurements using the Berkovich diamond tip with a load up to 700 and 210 mN were performed on 1-μm hydrogenated diamond-like carbon (DLCH) films and 6-μm polyimide (PI) films under different thermal treatment. The average nanohardness and elastic modulus from nanoindentation measurements are 25.13 and 192.18 GPa for as-deposited DLCH film and 22.93 and 174.22 GPa for as-annealed DLCH film, respectively. The ID/IG ratio of Raman spectra is 1.72 for as-deposited DLCH film and 2.04 for as-annealed DLCH film. The average nanohardness and elastic modulus from nanoindentation measurements are 0.37 and 5.58 GPa for 300 as-cured PI film and 0.42 and 5.19 GPa for 400 as-cured PI film, respectively. The relative cured rate is 92.1% for 300 as-cured PI film and 100% for 400 as-cured PI film. Both the nanohardness and elastic modulus derived from nanoindentation test results can correlate well with the trend of Raman spectra and FTIR spectra for hard DLCH film and soft PI film under different thermal treatment effects.

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Articles
Copyright
Copyright © Materials Research Society 2009

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References

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