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Effects of poly(ethylene glycol) additive molecular weight on the microstructure and properties of sol-gel-derived lead zirconate titanate thin films

Published online by Cambridge University Press:  31 January 2011

Shuhui Yu
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
Kui Yao*
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
Santiranjan Shannigrahi
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
Francis Tay Eng Hock
Affiliation:
Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
*
a)Address all correspondence to this author. e-mail: k-yao@imre.a-star.edu.sg
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Abstract

Poly(ethylene glycol) (PEG) additives with different molecular weights were used to modify sol-gel precursor solutions for preparing lead zirconate titanate (PZT) thin films. The morphology, crystalline structure, and mechanical and electrical properties of the films were characterized. The relationship between the characteristics of the films and the molecular weight of PEG was investigated. It was observed that the PEG eliminated cracking of the films during multiple pyrolysis treatments. However, with the increase of the PEG molecular weight, the films became less dense, which led to decreased Young's modulus and dielectric constant and increased coercive field. Our experiments showed that films prepared from sols modified by PEG with a molecular weight of 200 exhibited a dense morphology and excellent mechanical and electric properties without cracking.

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Articles
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1.Schwartz, R.W., Chem. Mater. 9, 2325 (1997).CrossRefGoogle Scholar
2.Shannigrahi, S.R. and Jang, H.M., Appl. Phys. Lett. 79, 1051 (2001).CrossRefGoogle Scholar
3.Kingon, A.I. and Streiffer, S.K, Curr. Opin. Solid State and Mater. Sci. 4, 39 (1999).CrossRefGoogle Scholar
4.Polla, D.L. and Francis, L.F., Annu. Rev. Mater. Sci. 28, 563 (1998).CrossRefGoogle Scholar
5.Ferroelectric Films V, edited by Desu, S.B., Ramesh, R., Tuttle, B.A., Jones, R.E., and Yoo, I.K. (Mater. Res. Soc. Symp. Proc. 433, Pittsburgh, PA, 1996).Google Scholar
6.Cheng, J. and Meng, Z., Thin Solid Films 385, 5 (2001).CrossRefGoogle Scholar
7.Liu, D. and Mevissen, J.P., Integr. Ferroelectr. 18, 263 (1997).CrossRefGoogle Scholar
8.Maki, K., Soyama, N., Mori, S., and Ogi, K., Jan. J. Appl. Phys. 39, 5421 (2000).CrossRefGoogle Scholar
9.Pu, X., Luo, W., Ding, A., Tian, Y., and Qiu, P., Phys. Status Solidi A 182, R10 (2000).3.0.CO;2-N>CrossRefGoogle Scholar
10.Kozuka, H., Kajimura, M., Hirano, T., and Katayama, K., J. Sol-Gel Sci. Techol. 19, 205 (2000).CrossRefGoogle Scholar
11.Takenaka, S. and Kozuka, H., Appl. Phys. Lett. 79, 3485 (2001).CrossRefGoogle Scholar
12.Hwang, H.J., Towata, A., Awano, M., and Toriyama, M., J. Am. Ceram. Soc. 84, 2323 (2001).CrossRefGoogle Scholar
13.Li, X., Zhang, H., Chi, F., Li, S., Xu, B., and Zhao, M., Mater. Sci. Eng., B 18, 209 (1993).CrossRefGoogle Scholar
14.Shimizu, Y. and Murata, T., J. Am. Ceram. Soc. 80, 2702 (1997).CrossRefGoogle Scholar