Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-13T10:33:05.458Z Has data issue: false hasContentIssue false
  • English
  • Français

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling – ERRATUM

Published online by Cambridge University Press:  17 February 2012

Hongtao Chen ,
Maik Mueller ,
Toni Tuomas Mattila ,
Jue Li ,
Xuwen Liu ,
Klaus-Juergen Wolter  and
Mervi Paulasto-Kröckel

Abstract

An abstract is not available for this content. As you have access to this content, full HTML content is provided on this page. A PDF of this content is also available in through the ‘Save PDF’ action button.
Type
Erratum
Information
Journal of Materials Research , Volume 27 , Issue 6 , 28 March 2012 , pp. 978
Copyright
Copyright © Materials Research Society 2012

doi: 10.1557/jmr.2011.197, Published by Cambridge University Press, 16 August 2011.

On the article opening page, the third author’s name was incorrectly published as “Tonu Tuomas Mattila.”

The correct spelling is Toni Tuomas Mattila.

The publisher regret the error.

References

REFERENCE

Chen, H., Mueller, M., Mattila, T.T., Li, J., Liu, X., Wolter, K.-J., Paulasto-Kröckel, M.: Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling. J. Mater. Res. 26, 2103 (2011).CrossRefGoogle Scholar