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Low-resistance films of polyimides with impregnated copper sulfide

Published online by Cambridge University Press:  31 January 2011

R. V. A. Rowe ,
M. H. Kunita ,
M. F. Porto ,
E. C. Muniz ,
A. F. Rubira ,
R. C. Nery ,
E. Radovanovic ,
L. T. Taylor  and
N. Nazem
R. V. A. Rowe
Affiliation:
Departamento de Química, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
M. H. Kunita
Affiliation:
Departamento de Química, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
M. F. Porto
Affiliation:
Departamento de Química, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
E. C. Muniz
Affiliation:
Departamento de Química, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
A. F. Rubira*
Affiliation:
Departamento de Química, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
R. C. Nery
Affiliation:
Departamento de Fisica, Universidade Estadual de Maringá, Av. Colombo 5790, 87020–900 Maringá-Pr, Brazil
E. Radovanovic
Affiliation:
Instituto de Química, Unicamp, C. Postal 3154, Campinas, SP, Brazil
L. T. Taylor
Affiliation:
Department of Chemistry, Virginia Tech, Blacksburg, Virginia 24061
N. Nazem
Affiliation:
Department of Chemistry, Virginia Tech, Blacksburg, Virginia 24061
*
a) Address all correspondence to this author.
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Abstract

Surface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton® polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 °C for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton® composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 11 , November 2001 , pp. 3097 - 3106
Copyright
Copyright © Materials Research Society 2001

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