Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Zou, H. F.
Yang, H. J.
and
Zhang, Z. F.
2009.
Controlling the morphology and orientation of Cu<inf>6</inf>Sn<inf>5</inf> through designing the orientations of Cu single crystals.
p.
1212.
Zou, H. F.
Yang, H. J.
and
Zhang, Z. F.
2009.
A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction.
Journal of Applied Physics,
Vol. 106,
Issue. 11,
Ocak, Y.
Aksöz, S.
Maraşlı, N.
and
Keşlioğlu, K.
2010.
Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy.
Intermetallics,
Vol. 18,
Issue. 11,
p.
2250.
Liu, Xiaoying
Huang, Mingliang
Zhao, Yanhui
Wu, C.M.L.
and
Wang, Lai
2010.
The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering.
Journal of Alloys and Compounds,
Vol. 492,
Issue. 1-2,
p.
433.
Zou, H. F.
and
Zhang, Z. F.
2010.
Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu).
Journal of Applied Physics,
Vol. 108,
Issue. 10,
Huan Liu
Mingliang Huang
Haitao Ma
and
Yipeng Cui
2010.
Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and on polycrystalline Ni.
p.
293.
Suh, J. O.
Tu, K. N.
Wu, Albert T.
and
Tamura, N.
2011.
Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni.
Journal of Applied Physics,
Vol. 109,
Issue. 12,
Huang, Na
Hu, Anmin
and
Li, Ming
2013.
Influence of texture of Cu on the growth of Cu–Sn intermetallic compounds.
Materials Letters,
Vol. 109,
Issue. ,
p.
8.
Qu, Lin
Ma, Haitao
Zhao, Huijing
Zhao, Ning
Kunwar, Anil
and
Huang, Mingliang
2013.
The nucleation of Ag<inf>3</inf>Sn and the growth orientation relationships with Cu<inf>6</inf>Sn<inf>5</inf>.
p.
377.
Wang, Kuang-Kuo
Chin, Pei-Ju
Yeh, Cheng-Fong
and
Gan, Dershin
2015.
The orientation relationships and interfaces of Ag3Sn and Ag4Sn on Ag and a discussion of their formation sequence.
Thin Solid Films,
Vol. 589,
Issue. ,
p.
27.
Zhang, Qingke
2016.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces.
p.
1.
Ke, J.H.
Gao, Y.
Kao, C.R.
and
Wang, Y.
2016.
Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates – A simulation study.
Acta Materialia,
Vol. 113,
Issue. ,
p.
245.
Mu, D.K.
McDonald, S.D.
Read, J.
Huang, H.
and
Nogita, K.
2016.
Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review.
Current Opinion in Solid State and Materials Science,
Vol. 20,
Issue. 2,
p.
55.
Ma, Z.L.
Xian, J.W.
Belyakov, S.A.
and
Gourlay, C.M.
2018.
Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds.
Acta Materialia,
Vol. 150,
Issue. ,
p.
281.
Ma, Z.L.
Li, C.
Yang, S.Y.
and
Cheng, X.W.
2020.
Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates.
Acta Materialia,
Vol. 194,
Issue. ,
p.
422.
Qiao, Yuanyuan
Liu, Xiaoying
Zhao, Ning
Wu, Lawrence C M
Liu, Chunying
and
Ma, Haitao
2021.
Morphology and orientation evolution of Cu6Sn5 grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient.
Journal of Materials Science & Technology,
Vol. 95,
Issue. ,
p.
29.