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Stress analysis of microwedge indentation-induced delamination

Published online by Cambridge University Press:  31 January 2011

MingHao Zhao ,
LiPan Yao  and
Tong-Yi Zhang
MingHao Zhao*
Affiliation:
Department of Engineering Mechanics, Zhengzhou University, Zhengzhou, Henan 450001, China
LiPan Yao
Affiliation:
Department of Engineering Mechanics, Zhengzhou University, Zhengzhou, Henan 450001, China
Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China
*
a) Address all correspondence to this author. e-mail: memhzhao@zzu.edu.cn;memhzhao@sina.com.
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Abstract

The indentation stress is the key and fundamental parameter in indentation delamination tests, which are widely used in characterization of the interfacial fracture toughness (or adhesion) between a thin film and its substrate. The indentation stress was analyzed in the present work by using the finite element method for microwedge indenters of different wedge angles and with various other geometrical and mechanical parameters including the penetration depth, film thickness, delamination size, Young's modulus, and yield strength of the indented film. The analysis exhibited the stress field under an indentation load and the stress field after unloading caused by plastic deformation, which resulted in the loading indentation stress and the unloading indentation stress, respectively, expressed by empirical formula in terms of the indenter geometry, the indentation depth, and the film thickness and mechanical properties. The energy release rate was also calculated for the indentation-induced interfacial crack.

Keywords

AdhesionFilmFracture
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 6 , June 2009 , pp. 1943 - 1949
Copyright
Copyright © Materials Research Society 2009

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References

1Marshall, D.B. and Evansc, A.G.: Measurement of adherence of residually stressed thin films by indentation. Mechanics of interface delamination. J. Appl. Phys. 56, 2632 (1984)CrossRefGoogle Scholar
2Evans, A.G. and Hutchinson, J.W.: On the mechanics of delamination and spalling in compressed films. Int. J. Solids Struct. 20, 455 (1984)CrossRefGoogle Scholar
3Volinsky, A.A., Moody, N.R., and Gerberich, W.W.: Interfacial toughness measurements for thin films on substrates. Acta Mater. 50, 441 (2002)CrossRefGoogle Scholar
4Huang, B., Zhao, M.H., Gao, C.F., and Zhang, T.Y.: Phase angle of indentation induced delamination with buckling. Scr. Mater. 50, 607 (2004)CrossRefGoogle Scholar
5Huang, B., Zhao, M.H., and Zhang, T.Y.: Indentation fracture and indentation delamination in ZnO film/Si substrate systems. Philos. Mag. 84, 1233 (2004)CrossRefGoogle Scholar
6Kriese, M.D., Moody, N.R., and Gerberich, W.W.: Quantitative adhesion measures of multilayer films: Part I. Indentation mechanics. J. Mater. Res. 14, 3007 (1999)CrossRefGoogle Scholar
7Kriese, M.D., Moody, N.R., and Gerberich, W.W.: Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W. J. Mater. Res. 14, 3019 (1999)CrossRefGoogle Scholar
8Li, M., Carter, C.B., Hillmyer, M.A., and Gerberich, W.W.: Adhesion of polymer-inorganic interfaces by nanoindentation. J. Mater. Res. 16, 3378 (2001)CrossRefGoogle Scholar
9Boer, M.P. de and Gerberich, W.W.: Microwedge indentation of the thin film fine line. I. Mechanics. Acta Mater. 44, 3169 (1996)CrossRefGoogle Scholar
10Boer, M.P. de and Gerberich, W.W.: Microwedge indentation of the thin film fine line. II. Experiment. Acta Mater. 44, 3177 (1996)CrossRefGoogle Scholar
11Cotterell, B. and Chen, Z.: Buckling and crackling of thin films on compliant substrate under compression. Int. J. Fract. 104, 169 (2000)CrossRefGoogle Scholar
12Yu, H.H. and Hutchinson, J.W.: Influence of substrate compliance on buckling delamination of thin films. Int. J. Fract. 113, 39 (2002)CrossRefGoogle Scholar
13Zhao, M.H., Yang, F., and Zhang, T.Y.: Delamination buckling in the micro-wedge indentation of a thin film on an elastically deformable substrate. Mech. Mater. 39, 881 (2007)CrossRefGoogle Scholar
14Liu, T., Hai, M., and Zhao, M.H.: Delaminating buckling model based on nonlocal Timoshenko beam. Eng. Fract. Mech. 75, 4909 (2008)CrossRefGoogle Scholar