Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2025-01-02T18:56:44.175Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermally-induced Crack Healing in Poly(Methyl Methacrylate)

Published online by Cambridge University Press:  31 January 2011

Jane-Sang Shen ,
Julie P. Harmon  and
Sanboh Lee
Jane-Sang Shen
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan
Julie P. Harmon
Affiliation:
Chemistry Department, University of South Florida, Tampa, Florida 33620–5250
Sanboh Lee
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan
Get access

Abstract

A microscopic theory of thermally induced crack healing in poly(methyl methacrylate) is presented. Both laser-induced cylindrical cracks and knife-induced surface cracks were analyzed. For a given temperature, the crack closure rate was constant for both types of cracks. However, the crack closure rate was lower for samples with cylindrical cracks than for those with surface cracks. The former exhibited higher activation energy for crack closure than the latter, because the knife-induced cracks had sharper crack tips. Fracture stress was proportional to surface crack healing time to the one-fourth power for thermal healing at a given temperature. Based on the reptation model of polymer chains, the activation energy of chain diffusion was calculated. The healing process was monitored via fractography and crack closure was confirmed. The results were compared with solvent healing and thermal healing in the literature.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 6 , June 2002 , pp. 1335 - 1340
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Wilson, B.A. and Case, E.D., J. Mater. Sci. 34, 247 (1999).CrossRefGoogle Scholar
2.Schmilz-Niederau, M. and Schuelze, M., Oxidation of Metals. 52, 241 (1999).CrossRefGoogle Scholar
3.Ackler, H.D., J. Amer. Ceram. Soc. 81, 3093 (1998).CrossRefGoogle Scholar
4.Zhang, Y.H., Edward, L., and Plumbridge, W.J., J. Amer. Ceram. Soc. 81, 1861 (1998).CrossRefGoogle Scholar
5.Chou, I.A., Chan, H.M., and Harmer, M.P., J. Amer. Ceram. Soc. 81, 1203 (1998).CrossRefGoogle Scholar
6.Yao, F., Ando, K., Chu, M.C., and Sato, S., J. Mater. Sci. Lett. 19, 1081 (2000).CrossRefGoogle Scholar
7.Wang, Z., Li, Y.Z., Harmer, M.P., and Chou, Y.T., J. Amer. Ceram. Soc. 75, 1596 (1992)CrossRefGoogle Scholar
8.Jang, S.M. and Lee, S., J. Amer. Ceram. Soc. 73, 659 (1990).CrossRefGoogle Scholar
9.Wool, R.P. and O’Connor, K.M., J. Appl. Phys. 52, 5953 (1981).CrossRefGoogle Scholar
10.O’Connor, K.M., Crack Healing in Polymers, (Fracture, Reptation, Tack); Ph.D. Thesis, University of Illinois, Urbana, IL (1984).Google Scholar
11.Wool, R.P., Polymer Interfaces. Structure and Strength (Hanser/ Gardner Publications, Inc., OH, 1995).Google Scholar
12.Jud, K. and Kausch, H.H., Polymer Bull. 1, 697 (1979).CrossRefGoogle Scholar
13.Jud, K., Kausch, K.H.H., and Williams, J.G., J. Mater. Sci. 16, 204 (1981).CrossRefGoogle Scholar
14.Wu, T. and Lee, S., J. Polym. Sci. Part B, Polym. Phys. 32, 5969 (1994).Google Scholar
15.Wang, P.P., Lee, S., and Harmon, J.P., J. Polym. Sci. Part B. Polym. Phys. 32, 1217 (1994).CrossRefGoogle Scholar
16.Lin, C.B., Lee, S., and Liu, K.S., Polym. Eng. Sci. 30, 1399 (1990).CrossRefGoogle Scholar
17.Hsieh, H-C., Yang, T-J., and Lee, S., Polymer. 42, 1227 (2001).CrossRefGoogle Scholar
18.Gupta, T.K., J. Amer. Ceram. Soc. 58, 143 (1975).CrossRefGoogle Scholar
19.Yu, C.C., Lin, C.B., and Lee, S., J. Appl. Phys. 78, 212 (1995).CrossRefGoogle Scholar
20.Wang, Z.Y., Harmer, M.P., and Chou, Y.T., J. Mater. Sci. 24, 2756 (1989).CrossRefGoogle Scholar
21.Zhou, B. and Chou, Y.T., J. Mater. Sci. Lett. 12, 1833 (1993).CrossRefGoogle Scholar
22.Li, Y.Z. and Chou, Y.T., Mater. Sci. Eng. A194, 113 (1995).CrossRefGoogle Scholar
23. P.G. de Gennes, J. Chem. Phys. 55, 572 (1971).CrossRefGoogle Scholar