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Thin Film Cracking and Ratcheting Caused by Temperature Cycling

Published online by Cambridge University Press:  31 January 2011

M. Huang ,
Z. Suo ,
Q. Ma  and
H. Fujimoto
M. Huang
Affiliation:
Mechanical and Aerospace Engineering Department and Materials Institute, Princeton University, Princeton, New Jersey 08544
Z. Suo
Affiliation:
Mechanical and Aerospace Engineering Department and Materials Institute, Princeton University, Princeton, New Jersey 08544
Q. Ma
Affiliation:
Intel Corporation, 2200 Mission College Boulevard, Santa Clara, California 95052
H. Fujimoto
Affiliation:
Intel Corporation, 2200 Mission College Boulevard, Santa Clara, California 95052
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Abstract

Layered materials are susceptible to failure upon temperature cycling. This paper describes an intriguing mechanism: cracking in a brittle layer caused by ratcheting in an adjacent ductile layer. For example, on a silicon die directly attached to an organic substrate, cracking often occurs in the silicon nitride film over aluminum pads. The silicon die and the organic substrate have different thermal expansion coefficients, inducing shear stresses at the die corners. Aided by cycling temperature, the shear stresses cause ratcheting in the aluminum pads. Incrementally, the stress relaxes in the aluminum pads and builds up in the overlaying silicon nitride film, leading to cracks.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 6 , June 2000 , pp. 1239 - 1242
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1.Yan, X. and Agarwal, R.K., ASME Trans. J. Electronic Packaging 120, 150 (1998).CrossRefGoogle Scholar
2.Gurmurthy, C.K., Jiao, J., Norris, L.G., Hui, C-Y., and Kramer, E.J., ASME Trans. J. Electronic Packaging 120, 372 (1998).CrossRefGoogle Scholar
3.Lau, J., Wong, C.P., Prince, J.L., and Nakayama, W., Electronic Packaging, Design, Materials Process, and Reliability (McGraw Hill, New York, 1998).Google Scholar
4.Edwards, D.R., Heinen, K.G., Groothuis, S.K., and Martinez, J.E., IEEE Trans. Components, Hybrids, and Manufacturing Technology 12, 618 (1987).CrossRefGoogle Scholar
5.Alpern, P., Wicher, V., and Tilgner, R., IEEE Trans. Components, Packaging, and Manufacturing Technology Part A 17, 583 (1994). Correction, 18, 862 (1995).CrossRefGoogle Scholar
6.Nguyen, L.T., Gee, S.A., Johnson, M.R., Grimm, H.E., Berardi, H., and Walberg, R.L., IEEE Trans. Components, Packaging, and Manufacturing Technology Part A 18, 15 (1995).CrossRefGoogle Scholar
7.Pendse, R.D., IEEE Trans. Components, Hybrids, and Manufacturing Technology 14, 870 (1991).CrossRefGoogle Scholar
8.Gee, S.A., Johnson, M.R., and Chen, K.L., IEEE Trans. Components, Packaging, and Manufacturing Technology Part B 18, 478 (1995).CrossRefGoogle Scholar
9.Liu, X.H., Suo, Z., and Ma, Q., Acta Mater. 47, 67 (1999).CrossRefGoogle Scholar
10.Qian, Z., Wang, J., Yang, J., and Liu, S., IEEE Trans. Components and Packaging Technology 22, 152 (1999).CrossRefGoogle Scholar
11.Nix, W.D., Metall. Trans. 20A, 2217 (1989).CrossRefGoogle Scholar
12.Ma, Q., Xie, J., Chao, S., El-Mansy, S., McFadden, R., and Fujimoto, H., in Materials Reliability in Microelectronics VIII, edited by Bravman, J.C., Marieb, T.N., Lloyd, J.R., and Korhonen, M.A. (Mater. Res. Soc. Symp. Proc. 516, Warrendale, PA, 1998), p. 331.Google Scholar
13.Isagawa, M., Iwasaki, Y., and Sutoh, T., Proc. Int. Reliability Physics Symp. 171 (1980).Google Scholar
14.Yan, S. and Ma, Q. (unpublished).Google Scholar
15.Bree, J., J. Strain Analysis 2, 226 (1967).CrossRefGoogle Scholar
16.Jansson, S. and Leckie, F.A., J. Mech. Phys. Solids 40, 593 (1992).CrossRefGoogle Scholar
17.Suresh, S., Fatigue of Materials, 2nd edition (Cambridge University Press, United Kingdom, 1998).CrossRefGoogle Scholar
18.Suo, Z., Acta Mater. 46, 3725 (1998).CrossRefGoogle Scholar