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Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)

Published online by Cambridge University Press:  18 July 2016

Chandrashekara S. Kaira ,
Carl R. Mayer ,
V. De Andrade ,
Francesco De Carlo  and
Nikhilesh Chawla
Chandrashekara S. Kaira
Affiliation:
Materials Science and Engineering, Arizona State University, Tempe, AZ 85287-6106, USA
Carl R. Mayer
Affiliation:
Materials Science and Engineering, Arizona State University, Tempe, AZ 85287-6106, USA
V. De Andrade
Affiliation:
Advanced Photon Source, Argonne National Laboratory, Building 401, 9700 S. Cass Avenue, Argonne, IL 60439, USA
Francesco De Carlo
Affiliation:
Advanced Photon Source, Argonne National Laboratory, Building 401, 9700 S. Cass Avenue, Argonne, IL 60439, USA
Nikhilesh Chawla*
Affiliation:
Materials Science and Engineering, Arizona State University, Tempe, AZ 85287-6106, USA
*
*Corresponding author. nchawla@asu.edu
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Abstract

Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.

Keywords

lead-free solderX-ray synchrotrontransmission X-ray microscopyintermetallics
Type
Materials Applications
Information
Microscopy and Microanalysis , Volume 22 , Issue 4 , August 2016 , pp. 808 - 813
Copyright
© Microscopy Society of America 2016 

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