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Advances in Atom Probe Specimen Fabrication from Planar Multilayer Thin Film Structures

Published online by Cambridge University Press:  02 February 2002

D.J. Larson ,
B.D. Wissman ,
R.L. Martens ,
R.J. Viellieux ,
T.F. Kelly ,
T.T. Gribb ,
H.F. Erskine  and
N. Tabat
D.J. Larson*
Affiliation:
Recording Head Operations, Seagate Technology, 7801 Computer Avenue South, NRW102, Bloomington, MN 55435
B.D. Wissman
Affiliation:
Recording Head Operations, Seagate Technology, 7801 Computer Avenue South, NRW102, Bloomington, MN 55435
R.L. Martens
Affiliation:
Imago Scientific Instruments Corporation, 6417 Normandy Lane, Madison, WI 53719
R.J. Viellieux
Affiliation:
Recording Head Operations, Seagate Technology, 7801 Computer Avenue South, NRW102, Bloomington, MN 55435
T.F. Kelly
Affiliation:
Imago Scientific Instruments Corporation, 6417 Normandy Lane, Madison, WI 53719 Department of Materials Science and Engineering, University of Wisconsin, 1500 Engineering Drive, Madison, WI 53706
T.T. Gribb
Affiliation:
Imago Scientific Instruments Corporation, 6417 Normandy Lane, Madison, WI 53719
H.F. Erskine
Affiliation:
Recording Head Operations, Seagate Technology, 7801 Computer Avenue South, NRW102, Bloomington, MN 55435
N. Tabat
Affiliation:
Recording Head Operations, Seagate Technology, 7801 Computer Avenue South, NRW102, Bloomington, MN 55435
*
*Corresponding author
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Abstract

A sample preparation method has been developed whereby sharp needle-shaped specimens for atom probe analysis are fabricated from multilayer thin films deposited onto silicon substrates. The specimens are fabricated in an orientation such that atom probe composition profiles across the layer interfaces can be determined with atomic-layer spatial resolution, i.e., the layer normals are parallel to the needle axis. The method uses standard silicon etching techniques and focused ion-beam milling. The feasibility and utility of this technique are shown through its application to a NiFe/CoFe/Cu/CoFe-based thin film structure.

Keywords

multilayer thin filmatom probe field ion microscopysilicon etchingion-beam millingthreedimensional atom probeswafer patterning process
Type
Research Article
Information
Microscopy and Microanalysis , Volume 7 , Issue 1 , January 2001 , pp. 24 - 31
Copyright
Copyright © Microscopy Society of America 2001

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