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Automated Grain Mapping Using Wide Angle Convergent Beam Electron Diffraction in Transmission Electron Microscope for Nanomaterials

Published online by Cambridge University Press:  09 November 2011

Vineet Kumar
Vineet Kumar*
Affiliation:
816A Beatty Village Rd., Latrobe, PA 15650, USA
*
Corresponding author. E-mail: vineet.bijnori@gmail.com
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Abstract

The grain size statistics, commonly derived from the grain map of a material sample, are important microstructure characteristics that greatly influence its properties. The grain map for nanomaterials is usually obtained manually by visual inspection of the transmission electron microscope (TEM) micrographs because automated methods do not perform satisfactorily. While the visual inspection method provides reliable results, it is a labor intensive process and is often prone to human errors. In this article, an automated grain mapping method is developed using TEM diffraction patterns. The presented method uses wide angle convergent beam diffraction in the TEM. The automated technique was applied on a platinum thin film sample to obtain the grain map and subsequently derive grain size statistics from it. The grain size statistics obtained with the automated method were found in good agreement with the visual inspection method.

Keywords

grain mappinggrain sizeTEMthin film
Type
Software and Techniques Development
Information
Microscopy and Microanalysis , Volume 17 , Issue 6 , December 2011 , pp. 859 - 865
Copyright
Copyright © Microscopy Society of America 2011

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References

REFERENCES

Allen, L.J., Josefsson, T.W., Lehmfuhl, G. & Uchida, Y. (1997). Modeling thermal diffuse scattering in electron diffraction involving higher order Laue zones. Acta Crystallogr A 53, 421–425.CrossRefGoogle Scholar
Carpenter, D.T., Codner, J.R., Barmak, K. & Rickman, J.M. (1999). Issues associated with the analysis and acquisition of thin film grain size data. Mater Lett 41, 296–302.CrossRefGoogle Scholar
Carpenter, D.T., Rickman, J.M. & Barmak, K. (1998). A methodology for automated quantitative microstructural analysis of transmission electron micrographs. J Appl Phys 84, 5843–5854.CrossRefGoogle Scholar
Darbal, A., Barmak, K., Nuhfer, T., Dingley, D.J., Meaden, G., Michael, J., Sun, T., Yao, B. & Coffey, K.R. (2009). Orientation imaging of nanocrystalling platinum films in the TEM. Microsc Microanal 15, 1232–1233.CrossRefGoogle Scholar
DeGraef, M. (2003). Introduction to Conventional Transmission Electron Microscopy. Cambridge, UK: Cambridge University Press.CrossRefGoogle Scholar
Dieter, G.E. (1986). Mechanical Metallurgy, 3rd ed.New York: McGraw-Hill.Google Scholar
Dingley, D.J. (1996). Method and apparatus for determining crystallographic characteristics. US Patent 5576543.Google Scholar
Fundenburger, J.J., Morawiec, A. & Bouzy, E. (2005). Advances in automatic TEM based orientation mapping. Solid Sate Phenom B 105, 37–42.CrossRefGoogle Scholar
Glass, S.J., Michael, J.R., Readey, M.J., Wright, S.I. & Field, D.P. (1998). Characterization of microstructure and crack propagation in alumina using orientation imaging microscopy (OIM). In Ceramic Microstructures—Control at the Atomic Level, Tomsia, A.E. & Glaeser, A.M. (Eds.), pp. 803–813. New York: Plenum Press.CrossRefGoogle Scholar
Haralick, R.M. & Linda, G.S. (1992). Computer and Robot Vision. Reading, MA: Addison-Wesley.Google Scholar
Kang, Y.J., Park, H.J. & Choi, G.M. (2008). The effect of grain size on the low temperature electrical conductivity of doped CeO2. Solid State Ionics 179, 1602–1605.CrossRefGoogle Scholar
Kirkland, E.J. (1998). Advanced Computing in Electron Microscopy. New York: Plenum Press.CrossRefGoogle Scholar
Ren, S.X., Kenik, E.A., Alexander, K.B. & Goyal, A. (1998). Exploring spatial resolution in electron backscattered diffraction experiments via Monte Carlo simulation. Microsc Microanal 4, 15–22.CrossRefGoogle ScholarPubMed
Sun, T., Yao, B., Warren, A.P., Barmak, K., Toney, M.F., Peale, R.E. & Coffey, K.R. (2009). Dominant role of grain boundary scattering in the resistivity of nanometric Cu films. Phys Rev B 79, 041402–041406.CrossRefGoogle Scholar
Wen, T.C. & Shetty, D.K. (2009). Birefringence and grain size effects on optical transmittance of polycrystalline magnesium fluoride. In Window and Dome Technologies and Materials XI, Proceedings of the SPIE, Tustison, R.W. (Ed.), pp. 1–6. Bellingham, WA: SPIE.Google Scholar
Williums, D.B. & Carter, C.B. (2004). Transmission Electron Microscopy: A Text Book for Materials Science, 1st ed.New York: Springer.Google Scholar
Wu, G. & Zaefferer, S. (2009). Advances in TEM orientation microscopy by combination of dark-field conical scanning and improved image matching. Ultramicroscopy 109, 1317–1325.CrossRefGoogle ScholarPubMed
Zaefferer, S. & Wu, G. (2008). Development of a TEM based orientation microscopy system. In Application of Texture Analysis: Ceramic Transactions, vol. 201, Rollett, A.D. (Ed.), pp. 221–228. Hoboken, NJ: John Wiley & Sons.CrossRefGoogle Scholar
Zuo, J.M. & Spence, J.C.H. (1992). Electron Microdiffraction. New York: Springer.Google Scholar