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Deformation localization in metallic glasses studied by in situ TEM deformation

Published online by Cambridge University Press:  01 August 2018

Christoph Gammer
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraße 12, 8700Leoben, Austria
Thomas C. Pekin
Affiliation:
National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, California94720, USA Department of Materials Science and Engineering, University of California, Berkeley, California94720, USA
Colin Ophus
Affiliation:
National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, California94720, USA
Andrew M. Minor
Affiliation:
National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, California94720, USA Department of Materials Science and Engineering, University of California, Berkeley, California94720, USA
Jürgen Eckert
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraße 12, 8700Leoben, Austria Department Materials Physics, Montanuniversität Leoben, Jahnstraße 12, 8700Leoben, Austria

Abstract

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Type
Abstract
Copyright
© Microscopy Society of America 2018 

References

[1] Ashby, M.F. Greer, A.L. Scripta Materialia 54 2006 321.Google Scholar
[2] Cubuk, E.D., et al., Science 358 2017 1033.Google Scholar
[3] Volkert, C.A., Donohue, A. Spaepen, F. Journal of Applied Physics 103 2008 83539.Google Scholar
[4] Gammer, C., Kacher, J., Czarnik, C., Warren, O.L., Ciston, J. Minor, A.M. Applied Physics Letters 109 2016 081906.Google Scholar
[5] Pekin, T.C., Gammer, C., Ciston, J., Ophus, C. Minor, A.M. Scripta Materialia 146 2018 87.Google Scholar
[6] The authors acknowledge support of the European Research Council under the ERC Advanced Grant INTELHYB (grant ERC-2013-ADG-340025). Work at the Molecular Foundry was supported by the Office of Science, Office of Basic Energy Sciences of the U.S. Department of Energy under Contract No. DE-AC02-05CH11231.Google Scholar