Hostname: page-component-cd9895bd7-hc48f Total loading time: 0 Render date: 2024-12-29T04:15:51.352Z Has data issue: false hasContentIssue false
  • English
  • Français

Direct-Writing of Cu Nano-Patterns with an Electron Beam

Published online by Cambridge University Press:  18 September 2015

Shih-En Lai ,
Ying-Jhan Hong ,
Yu-Ting Chen ,
Yu-Ting Kang ,
Pin Chang  and
Tri-Rung Yew
Shih-En Lai
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Ying-Jhan Hong
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Yu-Ting Chen
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Yu-Ting Kang
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Pin Chang
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Tri-Rung Yew*
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
*
*Corresponding author.tryew@mx.nthu.edu.tw
Get access

Abstract

We demonstrate direct electron beam writing of a nano-scale Cu pattern on a surface with a thin aqueous layer of CuSO4 solution. Electron beams are highly maneuverable down to nano-scales. Aqueous solutions facilitate a plentiful metal ion supply for practical industrial applications, which may require continued reliable writing of sophisticated patterns. A thin aqueous layer on a surface helps to confine the writing on the surface. For this demonstration, liquid sample holder (K-kit) for transmission electron microscope (TEM) was employed to form a sealed space in a TEM. The aqueous CuSO4 solution inside the sample holder was allowed to partially dry until a uniform thin layer was left on the surface. The electron beam thus reduced Cu ions in the solution to form the desired patterns. Furthermore, the influence of e-beam exposure time and CuSO4(aq) concentration on the Cu reduction was studied in this work. Two growth stages of Cu were shown in the plot of Cu thickness versus e-beam exposure time. The measured Cu reduction rate was found to be proportional to the CuSO4(aq) concentration.

Keywords

electron beam-induced depositiondirect writingCu patternliquid cellelectron microscopy
Type
Equipment and Techniques Development
Information
Microscopy and Microanalysis , Volume 21 , Supplement 6 , December 2015 , pp. 1639 - 1643
Copyright
© Microscopy Society of America 2015 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

a

These authors contributed equally to this work.

References

Bresin, M., Botman, A., Randolph, S.J., Straw, M. & Hastings, J.T. (2014). Liquid phase electron-beam-induced deposition on bulk substrates using environmental scanning electron microscopy. Microsc Microanal 20(2), 376–384.CrossRefGoogle ScholarPubMed
Bresin, M., Chamberlain, A., Donev, E.U., Samantaray, C.B., Schardien, G.S. & Hastings, J.T. (2013). Electron-beam-induced deposition of bimetallic nanostructures from bulk liquids. Angew Chem 52(31), 8004–8007.CrossRefGoogle ScholarPubMed
Chen, Y.T., Wang, C.Y., Hong, Y.J., Kang, Y.T., Lai, S.E., Chang, P. & Yew, T.R. (2014). Electron beam manipulation of gold nanoparticles. RSC Adv 4, 31652–31656.CrossRefGoogle Scholar
De, S., Higgins, T.M., Lyons, P.E., Doherty, E.M., Nirmalraj, P.N., Blau, W.J., Boland, J.J. & Coleman, J.N. (2009). Silver nanowire networks as flexible, transparent, conducting films extremely high DC to optical conductivity ratios. ACS Nano 3(7), 1767–1774.CrossRefGoogle ScholarPubMed
den Heijer, M., Shao, I., Radisic, A., Reuter, M.C. & Ross, F.M. (2014). Patterned electrochemical deposition of copper using an electron beam. APL Mater 2(2), 022101.CrossRefGoogle Scholar
Donev, E.U. & Hastings, J.T. (2009). Electron-beam-induced deposition of platinum from a liquid precursor. Nano Lett 9(7), 2715–2718.CrossRefGoogle ScholarPubMed
Friedli, V., Utke, I., Molhave, K. & Michler, J. (2009). Dose and energy dependence of mechanical properties of focused electron-beam-induced pillar deposits from Cu(C5HF6O2)2 . Nanotechnology 20(38), 385304.CrossRefGoogle ScholarPubMed
Grogan, J.M., Schneider, N.M., Ross, F.M. & Bau, H.H. (2014). Bubble and pattern formation in liquid induced by an electron beam. Nano Lett 14(1), 359–364.CrossRefGoogle ScholarPubMed
Liu, K.L. (2010). Novel microchip (K-kit) for in-situ transmission electron microscopy of living organisms in aqueous conditions. Doctoral Thesis. National Tsing-Hua University.Google Scholar
Liu, K.L., Wu, C.C., Huang, Y.J., Peng, H.L., Chang, H.Y., Chang, P., Hsu, L. & Yew, T.R. (2008). Novel microchip for in situ TEM imaging of living organisms and bio-reactions in aqueous conditions. Lab Chip 8(11), 1915–1921.CrossRefGoogle ScholarPubMed
Manshina, A., Povolotskiy, A., Ivanova, T., Kurochkin, A., Tver’yanovich, Y., Kim, D., Kim, M. & Kwon, S.C. (2007). CuCl2-based liquid electrolyte precursor for laser-induced metal deposition. Laser Phys Lett 4(3), 242–246.CrossRefGoogle Scholar
Ochiai, Y. (1996). Electron-beam-induced deposition of copper compound with low resistivity. J Vac Sci Technol B 14(6), 3887–3891.CrossRefGoogle Scholar
Ocola, L.E., Joshi-Imre, A., Kessel, C., Chen, B., Park, J., Gosztola, D. & Divan, R. (2012). Growth characterization of electron-beam-induced silver deposition from liquid precursor. J Vac Sci Technol B 30(6), 06FF08.CrossRefGoogle Scholar
Randolph, S.J., Botman, A. & Toth, M. (2013). Capsule-free fluid delivery and beam-induced electrodeposition in a scanning electron microscope. RSC Adv 3(43), 20016–20023.CrossRefGoogle Scholar
Schardein, G., Donev, E.U. & Hastings, J.T. (2011). Electron-beam-induced deposition of gold from aqueous solutions. Nanotechnology 22, 015301.CrossRefGoogle ScholarPubMed
Shelby, R.A., Smith, D.R. & Schultz, S. (2001). Experimental verification of a negative index of refraction. Science 292(5514), 77–79.CrossRefGoogle ScholarPubMed
Smith, D.R., Pendry, J.B. & Wiltshire, M.C. (2004). Metamaterials and negative refractive index. Science 305(5685), 788–792.CrossRefGoogle ScholarPubMed
Tai, L.A., Kang, Y.T., Chen, Y.C., Wang, Y.C., Wang, Y.J., Wu, Y.T., Liu, K.L., Wang, C.Y., Ko, Y.F., Chen, C.Y., Huang, N.C., Chen, J.K., Hsieh, Y.F., Yew, T.R. & Yang, C.S. (2012). Quantitative characterization of nanoparticles in blood by transmission electron microscopy with a window-type microchip nanopipet. Anal Chem 84(15), 6312–6316.CrossRefGoogle ScholarPubMed
Utke, I., Luisier, A., Hoffmann, P., Laub, D. & Buffat, P.A. (2002). Focused-electron-beam-induced deposition of freestanding three-dimensional nanostructures of pure coalesced copper crystals. Appl Phys Lett 81(17), 3245–3247.CrossRefGoogle Scholar
van de Groep, J., Spinelli, P. & Polman, A. (2012). Transparent conducting silver nanowire networks. Nano Lett 12(6), 3138–3144.CrossRefGoogle ScholarPubMed
Vazquez-Mena, O., Sannomiya, T., Villanueva, L.G., Voros, J. & Brugger, J. (2011). Metallic nanodot arrays by stencil lithography for plasmonic biosensing applications. ACS Nano 5(2), 844–853.CrossRefGoogle ScholarPubMed
Woehl, T.J., Jungjohann, K.L., Evans, J.E., Arslan, I., Ristenpart, W.D. & Browning, N.D. (2013). Experimental procedures to mitigate electron beam induced artifacts during in situ fluid imaging of nanomaterials. Ultramicroscopy 127, 53–63.CrossRefGoogle ScholarPubMed
Zhou, C., Zhang, Y., Li, Y. & Liu, J. (2013). Construction of high-capacitance 3D CoO@polypyrrole nanowire array electrode for aqueous asymmetric supercapacitor. Nano Lett 13(5), 2078–2085.CrossRefGoogle ScholarPubMed
Supplementary material: File

Lai supplementary material

Lai supplementary material 1

Download Lai supplementary material(File)
File 1.7 MB