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High Resolution FIB as a General Materials Science Tool

Published online by Cambridge University Press:  02 July 2020

M.W. Phaneuf ,
J. Li  and
T. Malis
M.W. Phaneuf
Affiliation:
Fibics Inc, 568 Booth St. Suite 224, Ottawa, CanadaKl A 0G1
J. Li
Affiliation:
Fibics Inc, 568 Booth St. Suite 224, Ottawa, CanadaKl A 0G1
T. Malis
Affiliation:
Materials Technology Laboratory, 568 Booth St., Ottawa, CanadaKl A 2E9
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Extract

Focused Ion Beam or FIB systems have been used in integrated circuit production for some time. The ability to combine rapid, precision focused ion beam sputtering or gas-assisted ion etching with focused ion beam deposition allows for rapid-prototyping of circuit modifications and failure analysis of defects even if they are buried deep within the chip's architecture. Inevitably, creative TEM researchers reasoned that a FIB could be used to produce site specific parallel-sided, electron transparent regions, thus bringing about the rather unique situation wherein the specimen preparation device often was worth as much as the TEM itself.

More recently, FIB manufacturers have concentrated on improving the resolution and imaging characteristics of these instruments, resulting in a more general-purpose characterization tool. The Micrion 2500 FIB system used in this study is capable of 4 nm imaging resolution using either secondary electron or secondary ions, both generated by a 50 kV liquid metal gallium ion source.

Type
Microscopy and Microanalysis in the “Real World”
Information
Microscopy and Microanalysis , Volume 4 , Issue S2: Proceedings: Microscopy & Microanalysis '98, Microscopy Society of America 56th Annual Meeting, Microbeam Analysis Society 32nd Annual Meeting, Atlanta, Georgia July 12-16, 1998 , July 1998 , pp. 492 - 493
Copyright
Copyright © Microscopy Society of America

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