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In Situ Electron Backscatter Diffraction Investigation of Recrystallization in a Copper Wire

Published online by Cambridge University Press:  10 April 2013

François Brisset ,
Anne-Laure Helbert  and
Thierry Baudin
François Brisset*
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, bât. 410, 91405 Orsay Cedex, France
Anne-Laure Helbert
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, bât. 410, 91405 Orsay Cedex, France
Thierry Baudin
Affiliation:
Université Paris-Sud, ICMMO, UMR CNRS 8182, bât. 410, 91405 Orsay Cedex, France
*
*Corresponding author.francois.brisset@u-psud.fr
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Abstract

The microstructural evolution of a cold drawn copper wire (reduction area of 38%) during primary recrystallization and grain growth was observed in situ by electron backscatter diffraction. Two thermal treatments were performed, and successive scans were acquired on samples undergoing heating from ambient temperature to a steady state of 200°C or 215°C. During a third in situ annealing, the temperature was continuously increased up to 600°C. Nuclei were observed to grow at the expense of the deformed microstructure. This growth was enhanced by the high stored energy difference between the nuclei and their neighbors (driving energy in recrystallization) and by the presence of high-angle grain boundaries of high mobility. In the early stages of growth, the nuclei twin and the newly created orientations continue to grow to the detriment of the strained copper. At high temperatures, the disappearance of some twins was evidenced by the migration of the incoherent twin boundaries. Thermal grooving of grain boundaries is observed at these high temperatures and affects the high mobile boundaries but tends to preserve the twin boundaries of lower energy. Thus, grooving may contribute to the twin vanishing.

Keywords

copperin situ heatingelectron backscatter diffraction (EBSD)recrystallizationnucleationtwinning
Type
EBSD Special Section
Information
Microscopy and Microanalysis , Volume 19 , Issue 4 , August 2013 , pp. 969 - 977
Copyright
Copyright © Microscopy Society of America 2013 

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