Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-29T20:22:18.750Z Has data issue: false hasContentIssue false
  • English
  • Français

A Novel Strategy to Effectively Characterize FinFET Device by Multidirectional Comprehensive Analytical TEM in Semiconductor Wafer-foundries

Published online by Cambridge University Press:  04 August 2017

Wayne Zhao ,
Bianzhu Fu ,
Yong Wei  and
Irene Brooks
Wayne Zhao
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, New York, USA.
Bianzhu Fu
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, New York, USA.
Yong Wei
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, New York, USA.
Irene Brooks
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, New York, USA.

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 23 , Supplement S1: Proceedings of Microscopy & Microanalysis 2017 , July 2017 , pp. 336 - 337
Copyright
© Microscopy Society of America 2017 

References

[1] Zhao, W., etal, Microscopy & Microanalysis Vol. 20(Supplement 3 2014). pp. 362–363.Google Scholar
[2] Zhao, W., et al. Proc. 38 t International Symposium for Testing and Failure Analysis, (2012), pp. 347~355.Google Scholar
[3] Zhao, W. Symp. Proc. the Material Research Society, 2002 Fall Meeting 2002 Vol. 738, pp. G7.15.1–6.Google Scholar
[4] Authors would like to express sincere thanks to Nicolas LaManque, Lowell Hodgkins, and Randy Newkirk, for their excellence in TEM-preparation, Yue Zhang for screening the TEM samples, and GLOBALFOUNDRIES Fab8 electrical failure analysis team for the fault-isolation. Thanks also go to Fab8 Characterization Management and Legal team for supports in the publication clearance, and to Ed Crawford for the proof-reading.Google Scholar