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Orientation Precision of Electron Backscatter Diffraction Measurements Near Grain Boundaries

Published online by Cambridge University Press:  28 February 2014

Stuart I. Wright ,
Matthew M. Nowell ,
René de Kloe  and
Lisa Chan
Stuart I. Wright*
Affiliation:
EDAX, 392 East 12300 South, Draper, UT 84020, USA
Matthew M. Nowell
Affiliation:
EDAX, 392 East 12300 South, Draper, UT 84020, USA
René de Kloe
Affiliation:
EDAX BV, Ringbaan Noord 103, 5046 AA Tilburg, The Netherlands
Lisa Chan
Affiliation:
TESCAN USA, 508 Thomson Park Drive, Cranberry TWP, PA 16066, USA
*
*Corresponding author.stuart.wright@ametek.com
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Abstract

Electron backscatter diffraction (EBSD) has become a common technique for measuring crystallographic orientations at spatial resolutions on the order of tens of nanometers and at angular resolutions <0.1°. In a recent search of EBSD papers using Google Scholar™, 60% were found to address some aspect of deformation. Generally, deformation manifests itself in EBSD measurements by small local misorientations. An increase in the local misorientation is often observed near grain boundaries in deformed microstructures. This may be indicative of dislocation pile-up at the boundaries but could also be due to a loss of orientation precision in the EBSD measurements. When the electron beam is positioned at or near a grain boundary, the diffraction volume contains the crystal lattices from the two grains separated by the boundary. Thus, the resulting pattern will contain contributions from both lattices. Such mixed patterns can pose some challenge to the EBSD pattern band detection and indexing algorithms. Through analysis of experimental local misorientation data and simulated pattern mixing, this work shows that some of the rise in local misorientation is an artifact due to the mixed patterns at the boundary but that the rise due to physical phenomena is also observed.

Keywords

electron backscatter diffractionEBSDorientation imaging microscopyOIMorientation precisionkernel average misorientationKAM
Type
Materials Applications
Information
Microscopy and Microanalysis , Volume 20 , Issue 3 , June 2014 , pp. 852 - 863
Copyright
© Microscopy Society of America 2014 

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