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TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers

Published online by Cambridge University Press:  29 August 2014

Sónia Simões Open the ORCID record for Sónia Simões [Opens in a new window] ,
Filomena Viana ,
Ana S. Ramos ,
Maria T. Vieira  and
Manuel F. Vieira
Sónia Simões*
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
Filomena Viana
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
Ana S. Ramos
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
Maria T. Vieira
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
Manuel F. Vieira
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
*
*Corresponding author. ssimoes@fe.up.pt
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Abstract

Diffusion bonding of TiAl alloys can be enhanced by the use of reactive nanolayer thin films as interlayers. Using these interlayers, it is possible to reduce the conventional bonding conditions (temperature, time, and pressure) and obtain sound and reliable joints. The microstructural characterization of the diffusion bond interfaces is a fundamental step toward understanding and identifying the bonding mechanisms and relating them to the strength of the joints. The interface of TiAl samples joined using Ni/Al nanolayers was characterized by transmission electron microscopy and scanning transmission electron microscopy. Microstructural characterization of the bond revealed that the interfaces consist of several thin layers of different composition and grain size (nanometric and micrometric). The bonding temperature (800, 900, or 1,000°C) determines the grain size and thickness of the layers present at the interface. Phase identification by high-resolution transmission electron microscopy combined with fast Fourier transform and electron energy-loss spectroscopy analyses reveals the presence of several intermetallic compounds: AlTiNi, NiAl, and Al2TiNi. For bonds produced at 800 and 900°C, nanometric grains of Ti were detected at the center of the interface.

Keywords

electron microscopydiffusion bondingmultilayer thin filmselectron energy-loss spectroscopyenergy-dispersive X-ray spectroscopy
Type
SPMicros Special Section
Information
Microscopy and Microanalysis , Volume 21 , Issue 1 , February 2015 , pp. 132 - 139
Copyright
© Microscopy Society of America 2014 

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References

Boettge, B., Braeuer, J., Wiemer, M., Petzold, M., Bagdahn, J. & Gessner, T. (2010). Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology. J Micromech Microeng 20, 064018 (8 pp.).CrossRefGoogle Scholar
Çam, G., Ipekoglu, G., Bohm, K.H. & Koçak, M. (2006). Investigation into the microstructure and mechanical properties of diffusion bonded TiAl alloys. J Mater Sci 41, 5273–5282.Google Scholar
Cao, J., Song, X.G., Wu, L.Z., Qi, J.L. & Feng, J.C. (2012). Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet. Thin Solid Films 520, 3528–3531.Google Scholar
Clemens, H. & Mayer, S. (2013). Design, processing, microstructure, properties and applications of advanced intermetallic TiAl alloys. Adv Eng Mater 15, 191–215.Google Scholar
Duckham, A., Spey, S.J., Wang, J., Reiss, M.E., Weihs, T.P., Besnoin, E. & Knio, O.M. (2004). Reactive nanostructure foil used as a heat source for joining titanium. J Appl Phys 96(4), 2336–2341.Google Scholar
Duarte, L., Ramos, A.S., Vieira, M.F., Viana, F., Vieira, M.T. & Koçak, M. (2006). Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as interlayers. Intermetallics 14, 1151–1156.CrossRefGoogle Scholar
Froes, F.H., Suryanarayana, C. & Eliezer, D. (1992). Synthesis, properties and application of titanium aluminides. J Mater Sci 27, 5113–5140.CrossRefGoogle Scholar
Lee, S.J., Wu, S.K. & Lin, R.Y. (1997). Infrared joining of TiAl intermetallics using Ti-15Cu-15Ni foil-I. The microstructure morphologies of joint interfaces. Acta Mater 46, 1283–1295.Google Scholar
Ramos, A.S., Vieira, M.T., Simões, S., Viana, F. & Vieira, M.F. (2009). Joining of superalloys to intermetallics using nanolayers. Adv Mater Res 59, 225–229.Google Scholar
Simões, S., Viana, F., Ventzke, V., Koçak, M., Ramos, A.S., Vieira, M.T. & Vieira, M. (2010 a). Diffusion bonding of TiAl using Ni/Al multilayers. J Mater Sci 45, 4351–4357.CrossRefGoogle Scholar
Simões, S., Viana, F., Ramos, A.S., Vieira, M.T. & Vieira, M.F. (2010 b). TEM characterization of as-deposited and annealed Ni/Al multilayer thin film. Microsc Microanal 16, 662–669.CrossRefGoogle ScholarPubMed
Simões, S., Viana, F., Ramos, A.S., Vieira, M.T. & Vieira, M.F. (2011). Anisothermal solid-state reactions of Ni/Al nanometric multilayers. Intermetallics 19, 350–356.Google Scholar
Simões, S., Viana, F. & Vieira, M.F. (2014). Reactive commercial Ni/Al nanolayers for joining lightweight alloys. J Mater Eng Perform 23, 1536–1543.CrossRefGoogle Scholar
Swiston, A.J. Jr., Hufnagel, T.C. & Weihs, T.P. (2003). Joining bulk metallic glass using reactive multilayer foils. Scr Mater 48, 1575–1580.Google Scholar
Threadgill, P.L. (1995). The prospects for joining titanium aluminides. Mater Sci Eng A Struct Mater Prop Microstruct Process 192–193, 640–646.Google Scholar
Veronesi, P., Rosa, R., Colombini, E., Leonelli, C., Poli, G. & Casagrande, A. (2011). Microwave assisted combustion synthesis of non-equilibrium intermetallic compounds. J Microwave Power 44(1), 46–56.Google Scholar
Wu, X. (2006). Review of alloy and process development of TiAl alloys. Intermetallics 14, 1114–1122.CrossRefGoogle Scholar
Zhang, J., Wu, F.-S., Zou, J., An, B. & Liu, H. (2009). Al/Ni multilayer used as a local heat source for mounting microelectronic components. Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on, 838–842. doi: 10.1109/ICEPT.2009.5270630.Google Scholar