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Three-dimensional Imaging of Nano-Voids in Copper Interconnects using Incoherent Bright Field (IBF) Tomography

Published online by Cambridge University Press:  31 July 2006

PA Ercius ,
DA Muller ,
M Weyland  and
LM Gignac
PA Ercius
Affiliation:
Cornell University
DA Muller
Affiliation:
Cornell University
M Weyland
Affiliation:
Cornell University
LM Gignac
Affiliation:
IBM TJ Watson Research Center

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2006 in Chicago, Illinois, USA, July 30 – August 3, 2006

Type
Abstract
Information
Microscopy and Microanalysis , Volume 12 , Issue S02 , August 2006 , pp. 1554 - 1555
Copyright
© 2006 Microscopy Society of America