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Experience with a Dicing Saw for Rapid Pre-FIB TEM Sample Preparation

Published online by Cambridge University Press:  14 March 2018

Jim Conner ,
James Beck  and
Bryan Tracy
Jim Conner*
Affiliation:
Freescale Semiconductor, Crolles, France and AustinTX
James Beck
Affiliation:
Freescale Semiconductor, Crolles, France and AustinTX
Bryan Tracy
Affiliation:
Spansion, SunnyvaleCA
*
j.conner@freescale.com

Extract

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Since the publication of the use of a dicing saw for TEM sample preparation, several analytical labs have adopted this method as standard practice for site-specific cross section and plan view samples. In this article, we would like to provide additional practical details of these procedures, and describe several extensions, including useful notes on batch processing, preparing samples with an area of interest very close to the sample edge, and a Focused Ion Beam (FIB)-compatible sample holder. We present an unusual amount of detail in these processes to show some of the evolution of the method since its introduction and to allow others to easily reproduce these results.

Type
Research Article
Information
Microscopy Today , Volume 13 , Issue 2 , March 2005 , pp. 26 - 29
Copyright
Copyright © Microscopy Society of America 2005

References

Tsung, L., Anciso, A., Davidson, B., Turner, R., Alqaq, T., and Skloss, A.. 2000. FIB/TEM Sample Preparation Using a Wafer Dicing Saw. Microscopy and Microanalysis Proceedings, vol. 6, supp. 2.Google Scholar
Model DAD321 from Disco Corporation, <http://www.discousa.com/>..>Google Scholar