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A Fast-Result Method of Planar Polishing for Optical Microscopy

Published online by Cambridge University Press:  14 March 2018

Joseph Rubin  and
Tim Hazeldine
Joseph Rubin
Affiliation:
ULTRA TEC Mfg., Inc.
Tim Hazeldine
Affiliation:
ULTRA TEC Mfg., Inc.

Extract

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The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.

Type
Research Article
Information
Microscopy Today , Volume 5 , Issue 9 , November 1997 , pp. 8 - 11
Copyright
Copyright © Microscopy Society of America 1997

References

"The Cutting and Polishing of Optical and Electronic Materials", (2nd ed) Fynn, GW & WJA Powell. Publ. Adam Hilger Ltd.Google Scholar
"The ULTRA TEC Precision Polishing Jigs", Technical Note UTTN083Google Scholar
The Mechanical Design of Physical Instruments". AFC Pollard, Publ. Adam HilgerGoogle Scholar