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3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Published online by Cambridge University Press:  01 February 2011

Jian-Qiang Lu ,
J. Jay McMahon  and
Ronald J. Gutmann
Jian-Qiang Lu
Affiliation:
luj@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
J. Jay McMahon
Affiliation:
j.jay.mcmahon@gmail.com, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
Ronald J. Gutmann
Affiliation:
gutmar@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
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Abstract

Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and differences in architectural advantages and technology challenges are presented, with recent research advances discussed.

Keywords

bondingelectronic materialmicroelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1112: Symposium E – Materials and Technologies for 3-D Integration , 2008 , 1112-E02-01
Copyright
Copyright © Materials Research Society 2009

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References

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