Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Tornblad, Olof
Breitholtz, Bo
Östling, Mikael
and
Lindefelt, Ulf
1994.
The influence of emitter properties on the heat generation in SiC and Si PIN diodes under forward conduction.
Physica Scripta,
Vol. T54,
Issue. ,
p.
60.
Velmre, E.
Udal, A.
Masszi, F.
and
Nordlander, E.
1995.
Simulation of Semiconductor Devices and Processes.
p.
340.
Harima, Hiroshi
Nakashima, Shin-ichi
and
Uemura, Tomoki
1995.
Raman scattering from anisotropic LO-phonon–plasmon–coupled mode in n-type 4H– and 6H–SiC.
Journal of Applied Physics,
Vol. 78,
Issue. 3,
p.
1996.
Alok, D.
and
Baliga, B.J.
1996.
Nitrogen implanted high voltage, planar, 6H-SiC N/sup +/-P junction diodes.
p.
107.
Allen, S.T.
Palmour, J.W.
Carter, C.H.
Weitzel, C.E.
Moore, K.E.
Nordquist, K.J.
and
Pond, L.L.
1996.
Silicon carbide MESFET's with 2 W/mm and 50% P.A.E. at 1.8 GHz.
p.
681.
Yoder, M.N.
1996.
Wide bandgap semiconductor materials and devices.
IEEE Transactions on Electron Devices,
Vol. 43,
Issue. 10,
p.
1633.
Weitzel, C.E.
Palmour, J.W.
Carter, C.H.
Moore, K.
Nordquist, K.K.
Allen, S.
Thero, C.
and
Bhatnagar, M.
1996.
Silicon carbide high-power devices.
IEEE Transactions on Electron Devices,
Vol. 43,
Issue. 10,
p.
1732.
Itoh, A.
Kimoto, T.
and
Matsunami, H.
1996.
Excellent reverse blocking characteristics of high-voltage 4H-SiC Schottky rectifiers with boron-implanted edge termination.
IEEE Electron Device Letters,
Vol. 17,
Issue. 3,
p.
139.
Bakowski, M.
Gustafsson, U.
and
Lindefelt, U.
1997.
Simulation of SiC High Power Devices.
physica status solidi (a),
Vol. 162,
Issue. 1,
p.
421.
Lades, M.
and
Wachutka, G.
1997.
Extended anisotropic mobility model applied to 4H/6H-SiC devices.
p.
169.
Weitzel, C. E.
and
Moore, K. E.
1997.
Silicon Carbide And Gallium Nitride Rf Power Devices.
MRS Proceedings,
Vol. 483,
Issue. ,
Chen, W. M.
Son, N. T.
Janzén, E.
Hofmann, D. M.
and
Meyer, B. K.
1997.
Effective Masses in SiC Determined by Cyclotron Resonance Experiments.
physica status solidi (a),
Vol. 162,
Issue. 1,
p.
79.
Scozzie, C. J.
McLean, F. B.
and
McGarrity, J. M.
1997.
Modeling the temperature response of 4H silicon carbide junction field-effect transistors.
Journal of Applied Physics,
Vol. 81,
Issue. 11,
p.
7687.
Palmour, J.W.
Singh, R.
Glass, R.C.
Kordina, O.
and
Carter, C.H.
1997.
Silicon carbide for power devices.
p.
25.
Itoh, A.
and
Matsunami, H.
1997.
Analysis of Schottky Barrier Heights of Metal/SiC Contacts and Its Possible Application to High-Voltage Rectifying Devices.
physica status solidi (a),
Vol. 162,
Issue. 1,
p.
389.
Itoh, Akira
and
Matsunami, Hiroyuki
1997.
Single crystal growth of SiC and electronic devices.
Critical Reviews in Solid State and Materials Sciences,
Vol. 22,
Issue. 2,
p.
111.
Sridevan, S.
McLarty, P.K.
and
Baliga, B.J.
1997.
Analysis of gate dielectrics for SiC power UMOSFETS.
p.
153.
Shenoy, J.N.
Cooper, J.A.
and
Melloch, M.R.
1997.
High-voltage double-implanted power MOSFET's in 6H-SiC.
IEEE Electron Device Letters,
Vol. 18,
Issue. 3,
p.
93.
Rodrigues, R.G.
Piccone, D.E.
Tobin, W.H.
Willinger, L.W.
Barrow, J.A.
Hansen, T.A.
Zhao, J.
and
Cao, L.
1998.
Operation of power semiconductors at their thermal limit.
Vol. 2,
Issue. ,
p.
942.
Neudeck, P.G
Huang, W
and
Dudley, M
1998.
Breakdown degradation associated with elementary screw dislocations in 4H-SiC p+n junction rectifiers.
Solid-State Electronics,
Vol. 42,
Issue. 12,
p.
2157.