Published online by Cambridge University Press: 17 March 2011
Boron, a P-type dopant, experiences Transient Enhanced Diffusion (TED) via interstitials. The Boron TED and {311} dissolution rates are explored as a function of implant energy dependence. Silicon implants of 1014/cm2 at 20, 40, 80, and 160 keV were used to damage the surface of a wafer with an epitaxially grown boron marker layer. Samples were annealed at 750°C for 15 to 135 minutes and 800°C for 10 to 30 minutes to observe the diffusion exhibited by the marker layer and to correlate this with the dissolution of {311} type defects. The diffusion enhancement depends strongly on implant energy but the {311} dissolution rate is weakly dependent.