Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-11T07:01:44.172Z Has data issue: false hasContentIssue false

Fabrication of MEMS Tonpilz Transducers

Published online by Cambridge University Press:  15 March 2011

Q. F. Zhou
Affiliation:
Materials Research Institute, Department of Bioengineering, Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
L.-P. Wang
Affiliation:
Materials Research Institute, Department of Bioengineering, Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
G. Gerber
Affiliation:
Department of Bioengineering, Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
R. Meyer Jr.
Affiliation:
Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
D. Van Tol
Affiliation:
Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
S. Tadigadapa
Affiliation:
Materials Research Institute, Department of Bioengineering, Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
W. J. Hughes
Affiliation:
Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
S. Trolier-McKinstry
Affiliation:
Materials Research Institute, Department of Bioengineering, Applied Research Laboratory, The Pennsylvania State University, University Park, PA 16802, U. S. A.
Get access

Abstract

Tonpilz transducers consist of a heavy tail mass, a piezoelectric spring, and a light head mass. Miniaturized tonpilz transducers are potentially interesting for the 10 to100 MHz frequency range in imaging transducers due to their high efficiency and output capabilities. Piezoelectric thin films can be used as the active element in the construction of miniaturized tonpilz structures. A 4-10 νm film is necessary for the mass-spring-mass system to resonate at these high frequencies. In this work, fabrication and characterization of lead zirconate titanate (PZT) thick films on conductive oxide LaNiO3 (LNO) coated silicon on insulator (SOI) substrates will be reported for this application. First, conductive LNO thin films, approximately 300 nm in thickness, were grown on SOI substrates by a metal-organic decomposition (MOD) method. The room temperature resistivity of the LNO was 6.5×10-4 ωcm. Randomly oriented PZT (52/48) films up to 7 νm thick were then deposited using a sol-gel process on the LNO coated SOI substrates. 20 mol.% excess lead was added to the solutions to compensate for lead volatilization during film heat treatments. PZT films with LNO bottom electrodes showed good dielectric and ferroelectric properties. The dielectric permittivity (at 1 kHz) was over 1000. The remanent polarization of PZT films was larger than 26 νC/cm2. The e31,f coefficient of PZT thick films was larger than –6.5 C/m2 when poled at -75 kV/cm for 15 minutes. A silver layer approximately 40 νm thick was screen- printed onto the PZT film to form the tail mass of the tonpilz structure. Elements were diced and the bulk silicon was removed by dry and wet-etching methods to leave the p-type silicon layer as tonpilz head mass. Fabrication of MEMS tonpilz microstructures will also be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Bernstein, J. J., Finberg, S. L., Houston, K., Cross, L. E. et al. , IEEE Transducers on Ferroelectric and Frequency Control, 44, 960 (1997)Google Scholar
2. Lukacs, M., Sayer, M., Knapik, D., Candelaa, R. and Foster, F. S., 1996 IEEE Ultrasonics Syposium, 901 (1996).Google Scholar
3. Zhou, Q. F., Chan, H. L. W. and Choy, C. L., Thin Solid Films, 375, 95 (2000).Google Scholar
4. Sugiyama, S., Takagi, A. and Tsuzuki, K., Jap. J. Appl. Phys., 30, 2170 (1991).Google Scholar
5. Barrow, D. A., Petroff, T. E. and Sayer, M., Surface and Coating Technology, 76, 113 (1995).Google Scholar
6. Chen, H. D., Udayakumar, K. R., Gaskey, C. J. and Cross, L. E., J. Am. Ceram. Soc., 79, 2189 (1996).Google Scholar
7. Kurchania, R. and Milne, S.J., J. Mater.Res., 14, 1852 (1999).Google Scholar
8. Hunt, F.V., Electroacoustics: The analysis of transduction, and its historical background, American Institute of physics, college park, MD, 1982.Google Scholar
9. Tol, D. Van, Hughes, W. J., Proceeding of the SPIE on ultrasonic transducer engineering, 3664, 161 (1999).Google Scholar
10. Krimholtz, R., Leedom, D. A., Matthaei, G. L., Electronics Letters, 6, 398 (1970).Google Scholar
11. Zhou, Q. F., Hong, E., Wolf, R., and Trolier-McKinstry, S., Materials Research Society Symposium proceedings. Vol.655, 2000 Fall Meeting (Boston), Ferroelectric thin films.Google Scholar
12. Shepard, J. F. Jr., Moses, P. J., and Trolier-McKinstry, S. S., Sensors and Actuators A 71, 133 (1998).Google Scholar
13. Chen, S. Y., J. Amer. Ceram. Soc. 81, 97 (1998).Google Scholar
14. Zhang, Z.S., M. S. Thesis, The Pennsylvania State University, 2000.Google Scholar
15. Shephard, F. Jr., Xu, F., Kanno, I., and Trolier-McKinstry, S., J. Appl. Phys., 85, 6711 (1999).Google Scholar