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Microwave Dynamic Dielectric Analysis of Curing Neat Resins

Published online by Cambridge University Press:  25 February 2011

Ray J. King ,
Michael J. Werner  and
Guillermo D. Mayorga
Ray J. King
Affiliation:
KDC Technology Corp., 2011 Research Drive, Livermore, CA 94550
Michael J. Werner
Affiliation:
KDC Technology Corp., 2011 Research Drive, Livermore, CA 94550
Guillermo D. Mayorga
Affiliation:
Hexcel Corp., Dublin, CA 94568
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Abstract

Microwave reflection resonator sensors have been developed to monitor the dynamic, in situ real and imaginary dielectric components (ε′, ε″) of thermoset polymer matrix composites and thermoplastics. These reusable and noninvasive sensors are conformably mounted in the autoclave mold in such a manner that the EM fields are strongly coupled to the resin. Tracking of (ε′, ε″) during the cure provides information about the chemical kinetics such as timing the point of minimum viscosity and monitoring the relative cure index. The sensor is readily adjustable for optimum coupling to the type of material being tested and is rated for temperatures up to 250°C (480*F). The technique is complementary to other analysis techniques such as Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA). A prototype software and electronics package has been developed to support the sensor.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 269: Symposium L – Microwave Processing of Materials III , 1992 , 409
Copyright
Copyright © Materials Research Society 1992

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References

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