Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-11T07:06:15.778Z Has data issue: false hasContentIssue false
  • English
  • Français

Reductions in the Lattice Thermal Conductivity of Ball-milled and Shock compacted TiNiSn1−XSbX Half-Heusler alloys

Published online by Cambridge University Press:  21 March 2011

S. Bhattacharya ,
Y. Xia ,
V. Ponnambalam ,
S.J. Poon ,
N. Thadani  and
T.M. Tritt
S. Bhattacharya
Affiliation:
Department of Physics and Astronomy, Clemson University, Clemson, SC, USA
Y. Xia
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
V. Ponnambalam
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
S.J. Poon
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
N. Thadani
Affiliation:
Department of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA
T.M. Tritt
Affiliation:
Department of Physics and Astronomy, Clemson University, Clemson, SC, USA
Get access

Abstract

Half-Heusler alloys are currently being investigated for their potential as thermoelectric materials [1], [2]. They exhibit high negative thermopower (40-250μV/K) and favorable electrical resistivity (0.1-8mW•cm) at room temperature. Attractive power factors (α2σT) of about (0.2-1.0W/m•K) at room temperature and about 4W/m•K at 600K [3] have been reported in these materials. But in order to achieve a high figure-of-merit in the half-Heusler alloys, the relatively high thermal conductivity in these materials (∼ 10 W/m•K) must be reduced. The thermal conductivity in these materials is composed of mainly a lattice contribution, compared to a very small electronic component. The challenge is to reduce the relatively high lattice thermal conductivity in these materials. Reported in this paper is a significant reduction of lattice thermal conductivity (∼1.5 - 3.5W/m•K) in some Ti-based half-Heusler alloys. Samples have been prepared by ball milling and followed by shock-compaction that has resulted into reduced grain sizes in these materials. The effects of the microstructure on the thermal transport properties of the Half-Heusler alloys have been investigated and are presented and discussed herein.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 691: Symposium G – Thermoelectric Materials 2001--Research and Applications , 2001 , G7.1
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Uher, C., Yang, J., Hu, S., Morelli, D.T. and Meisner, G.P., Phys. Rev B 59, 8615 (1999).Google Scholar
2 Hohl, H., Ramirez, A.P., Goldmann, C., Ernst, G., Wölfing, B. and Bucher, E., J.Phys.: Condens. Matter. 11, 1697 (1999).Google Scholar
3 Bhattacharya, S., Pope, A.L., Littleton, R.T. IV, Tritt, Terry M., Ponnambalam, V., Xia, Y. and Poon, S.J., Appl. Phys. Lett. 77, 2476 (2000).Google Scholar
4 Jeitschko, W., Metall.Trans. 1, 3159 (1970).Google Scholar
5 Aliev, F.G., Kozyrkov, V.V., Moshchalkov, V.V., Scolozdra, R.V. and Durczewski, K., Z.Phys.BCondens. Matter 80, 353 (1990).Google Scholar
6 Tritt, Terry M., Bhattacharya, S., Xia, Y., Ponnambalam, V., Poon, S.J. and Thadhani, N., 2001 ICT Symposium Proc.Google Scholar
7 Savvides, N. and Goldsmid, H.J., J. Physics. C: Solid St. Phys., 13, 4657 (1980).Google Scholar
8 Rowe, D.M. and Shukla, V. S., J. Appl. Phys. 52(12), 7421 (1981).Google Scholar
9 Bhandari, C.M. and Rowe, D.M., J. Phys. D: Appl. Phys., 16, L75–L77 (1983).Google Scholar
10 Goldsmid, H.J., Penn, A.W., Phys. Lett, 27A 523 (1968).Google Scholar
11 Klemens, P.G., in ‘Theory of Thermal Conductivity of Solids’ in Thermal Conductivity, edited by Tye, R.P..Google Scholar
12 Rowe, D.M. and Bhandari, C.M., Appl. Phys. Lett. 47, 255 (1985).Google Scholar
13 Sharp, J.W., Poon, S.J. and Goldsmid, H.J., 2000 ICT Symposium Proceedings.Google Scholar
14 Pope, A. L., Littleton, R. T. IV, andTritt, Terry M., Rev. Sci. Instrum., 72, 3129 (2001)Google Scholar
15 Pope, A. L., Zawilski, B. M. and Terry Tritt, M., In Press,: Cryogenics. in press (July 2001).Google Scholar