Published online by Cambridge University Press: 01 February 2011
The strain in the strained Si layer on a blanket strained Si/SiGe structure could not be determined with only convergent beam electron diffraction to high order Laue zone (HOLZ) line splitting. Combined with CBED and finite element calculations, we quantified the deformation field from HOLZ line splitting and demonstrated a procedure to determine the initial strain in the strained Si layer. Our results also gave us insights in strain relaxation in a TEM sample. The CBED technique combined with FE modeling has the potential for initial strain measurements on new generation short channel CMOS technology nodes.