Published online by Cambridge University Press: 26 February 2011
In this paper the creep behavior and the microstructural stability of Ti-46Al-9Nb (in at.%) sheet material were investigated in the temperature range of 700°C to 815°C. The study involves three different types of microstructure, namely fully lamellar with narrow lamellar spacing, duplex and massively transformed. Short-term creep experiments conducted at 700°C and 225 MPa confirmed that the lamellar microstructure with narrow lamellar spacing exhibits a much higher creep resistance when compared to the massively transformed and duplex ones. During longterm creep tests up to 1500 hours stress exponents (in the range of 4.4 to 5.8) and apparent activation energies (of about 4 eV) have been estimated by means of load and temperature changes, respectively. Both, stress exponents and activation energies suggest that under the applied conditions diffusion-assisted climb of dislocations is the dominant creep mechanism. The thermal stability of the different microstructures under various creep conditions has been analyzed by electron microscopy and X-ray diffraction. Our investigations revealed considerable stress and temperature induced microstructural changes which are reflected in the dissolution of the α2 phase accompanied by precipitation of a Ti/Nb - rich phase situated at grain boundaries. This phase was identified as a ω-related phase with B82-type structure. It was shown, that in particular the duplex microstructure is prone to such microstructural instabilities.