Hostname: page-component-745bb68f8f-mzp66 Total loading time: 0 Render date: 2025-01-15T06:50:04.905Z Has data issue: false hasContentIssue false
  • English
  • Français

Determining Stress-strain Curves for Thin Films by Experimental/Computational Nanoindentation

Published online by Cambridge University Press:  01 February 2011

Baik-Woo Lee ,
Yeol Choi ,
Yun-Hee Lee ,
Ju-Young Kim  and
Dongil Kwon
Baik-Woo Lee
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–744, Korea
Yeol Choi
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–744, Korea
Yun-Hee Lee
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–744, Korea
Ju-Young Kim
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–744, Korea
Dongil Kwon
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–744, Korea
Get access

Abstract

The nanoindentation technique has great promise in evaluating mechanical properties such as nanohardness and elastic modulus at micrometer or nanometer scales, since sample preparation and testing procedures are very easy. However, the nanohardness and elastic modulus cannot be directly related to basic material flow properties. Here a novel and simple experimental/computational method is proposed to extract stress-strain curves based on finite-element modeling (FEM) of nanoindentation. This method was verified for bulk Al by comparing the stress-strain curves extracted with those obtained from tensile testing, and was applied to Al thin films (0.5 μm and 1 μm) deposited on a Si substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U11.14
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Arzt, E., Acta Mater. 46, 5611 (1998).Google Scholar
2. Dao, M., Chollacoop, N., Van Vliet, K.J., Venkatesh, T.A. and Suresh, S., Acta Mater. 49, 3899 (2001).Google Scholar
3. Jayaraman, S., Hahn, G.T., Oliver, W.C., Rubin, C.A. and Bastias, P.C., Int. J. Solids Structures 35, 365 (1998).Google Scholar
4. Stauss, S., Schwaller, P., Bucaille, J.-L., Rabe, R., Rohr, L., Michler, J. and Blank, E., Microelectron. Eng. 67–68, 818 (2003).Google Scholar
5. Bouzakis, K.-D., Michailidis, N. and Erkens, G., Surf. Coat. Tech. 142–244, 102 (2001).Google Scholar
6. Cheng, Y.T. and Cheng, C.M., J. Mater. Res. 14, 3493 (1999).Google Scholar
7. ABAQUS/Standard (Hibbitt, Karlsson and Sorensen, Inc., Pawtucket, RI, 1998).Google Scholar
8. Oliver, W.C. and Pharr, G. M., J. Mater. Res. 7, 1564 (1992).Google Scholar
9. MPDB Software, Temperature Dependent Elastic and Thermal Properties Database (MA: JAHM Software, 2002).Google Scholar
10. Pharr, G.M., Mat. Sci. Eng. A-Struct. 253, 151 (1998).Google Scholar
11. Bahr, D.F., Kramer, D.E. and Gerberich, W.W., Acta Mater. 46, 3605 (1998).Google Scholar
12. Ma, D., Xu, K., He, J. and Lu, J., Surf. Coat. Tech. 116–119, 128 (1999).Google Scholar
13. Son, D., Jeong, J.-h. and Kwon, D., Thin Solid Films 437, 182 (2003).Google Scholar