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Effect of As-Processed and Annealed Microstructures on the Mechanical Properties of Liga Ni MEMS

Published online by Cambridge University Press:  10 February 2011

Z. L. Xie ,
D. Pan ,
H. Last  and
K. J. Hemker
Z. L. Xie
Affiliation:
Dept. of Mechanical Engineering, The Johns Hopkins University, Baltimore, MD 21218
D. Pan
Affiliation:
Dept. of Mechanical Engineering, The Johns Hopkins University, Baltimore, MD 21218
H. Last
Affiliation:
Naval Surface Warfare Center, Indian Head Division, Indian Head, MD 20640
K. J. Hemker
Affiliation:
Dept. of Mechanical Engineering, The Johns Hopkins University, Baltimore, MD 21218
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Abstract

Microstructure – mechanical property relations of 200 μm thick LIGA deposited Ni films have been investigated with a combination of optical cross-sectional microscopy and microsample tensile testing. Measurements of the grain size and morphology of nine different asdeposited films evidenced a predominantly columnar microstructure with significant variations in grain size. These as-deposited microstructural variations resulted in a range of Young's modulus, yield strength, and ultimate tensile strength values that are consistent with previously reported measurements, but these values did not appear to scale with the as-deposited microstructures. By contrast, significant changes in both the microstructure and mechanical properties were observed when these films were annealed at 800'C for 1 hour. Recrystallization and grain growth transformed the grain morphology from columnar to equiaxed, which resulted in a dramatic decrease in the tensile strength and corresponding increase in the ductility of the annealed films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 197
Copyright
Copyright © Materials Research Society 2000

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References

1. Jayaraman, S., Edwards, R.L. and Hemker, K.J., J. Mater. Res., 14 (3), 688–697, (1999).Google Scholar
2. Mazza, E., Abel, S. and Dual, J., Microsystem Tech., 2 (4), 197–202, (1996).10.1007/s005420050044Google Scholar
3. Dual, J., Mazza, E., Schiltges, G. and Schlums, D., Proc. SPIE, 3225, 12–22, (1997).10.1117/12.284550Google Scholar
4. Sharpe, W.N. Jr., LaVan, D.A. and Edwards, R.L., Proc. Transducers' 97 IEEE, Chicago, IL, 607–610 (1997).Google Scholar
5. Sharpe, W.N. Jr., LaVan, D.A. and McAleavey, A., Micro-Electro-Mechanical Systems (MEMS), ASME DSC, 62/HTD-Vol. 354, 93–97, (1997).Google Scholar
6. Sharpe, W.N. Jr., and McAleavey, A., Proc. SPIE, 3512, 130–137, (1998).Google Scholar
7. Christenson, T.R., Buchheit, T.E., Schmale, D.T. and Bourcier, R.J., MRS Symp Proc., 518, 185–190, (1998).Google Scholar
8. Basrour, S., Robert, L., Ballandras, S. and Hauden, D., Transducers' 97 IEEE, Chicago, IL, 599–602 (1997).Google Scholar
9. Fan, L., Last, H., Wood, R., Dudley, B., Malek, C. Khan, and Ling, Z.. Microsystems Tech., 4 (4), 168–171, (1998).Google Scholar
10. Sharpe, W.N. Jr., NASA Report No. 101638, (1989).Google Scholar