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Effects of Structural Properties of Hf-Based Gate Stack on Transistor Performance

Published online by Cambridge University Press:  28 July 2011

G. Bersuker
Affiliation:
International SEMATECH
J. H. Sim
Affiliation:
International SEMATECH
C. D. Young
Affiliation:
International SEMATECH
R. Choi
Affiliation:
International SEMATECH
B. H. Lee
Affiliation:
On assignment from IBM
P. Lysaght
Affiliation:
International SEMATECH
G. A. Brown
Affiliation:
International SEMATECH
P. M. Zeitzoff
Affiliation:
International SEMATECH
M. Gardner
Affiliation:
On assignment from AMD
R. W. Murto
Affiliation:
On assignment from TI
H. R. Huff
Affiliation:
International SEMATECH
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Abstract

Electron traps in ALD and MOCVD HfO2 and HfSiO high-k dielectrics were investigated using both conventional DC and pulse measurements. It was found that the traps in the gate stack could be associated with defects of different activation energies and capture cross-sections. This points to potentially different origins of the electrically active defects, which can be either intrinsic or process-related. Structural non-uniformity of the high-k film, associated with grain formation and phase separation, may lead to variation of electrical properties of the gate dielectric along the transistor channel. Effects of such dielectric non-uniformity, as well as electron trapping, on the measured transistor mobility were evaluated.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

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