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Electronic Determination of the Modulus of Elasticity and Intrinsic Stress of Thin Films using Capacitive Bridges

Published online by Cambridge University Press:  15 February 2011

Sha Wang ,
Selden Crary  and
Khalil Najafi
Sha Wang
Affiliation:
Center for Integrated Sensors and Circuits, Electrical Engineering and Computer Science Dep't., The University of Michigan, Ann Arbor, MI 48109-2122
Selden Crary
Affiliation:
Center for Integrated Sensors and Circuits, Electrical Engineering and Computer Science Dep't., The University of Michigan, Ann Arbor, MI 48109-2122
Khalil Najafi
Affiliation:
Center for Integrated Sensors and Circuits, Electrical Engineering and Computer Science Dep't., The University of Michigan, Ann Arbor, MI 48109-2122
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Abstract

We extend the method of Najafi and Suzuki [1] for the electronic determination of the modulus of elasticity and intrinsic stress of thin films using capacitive bridge structures. New theoretical concepts are introduced. The extended method does not require that the test structures be exercised to the point of snap-action.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 276: Symposia U/Y – Smart Materials Fabrication and Materials for Micro-Electro-Mechanical Systems , 1992 , 203
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

1. Najafi, K. and Suzuki, K., Thin Solid Films, 181, 251 (1989).Google Scholar
2. Nathanson, H. C., Newell, W. E., Wickstrom, R. A., and Davis, J. R. Jr., IEEE Trans. Electron Devices 14, 117 (1967).Google Scholar
3. Ko, W. H., Suminto, J. T., and Yeh, G. J., Micromachining and Micropackaging of Transducers, (Elsevier, 1985).Google Scholar