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Fabrication of Multiwall Carbon Nanotube-nanocrystalline Copper Nanocomposite Film by Electrochemical Deposition

Published online by Cambridge University Press:  01 February 2011

JungJoon Yoo ,
JaeYong Song  and
Jin Yu
JungJoon Yoo
Affiliation:
jungjoon_yoo@kaist.ac.kr, Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea, Republic of, +82-42-869-4274, +82-42-869-8840
JaeYong Song
Affiliation:
jysong@kriss.re.kr, Korea Research Institute of Standards and Science, Division of Advanced Technology, 1 Doryong-dong, Yuseong-gu, Daejeon, 305-600, Korea, Republic of
Jin Yu
Affiliation:
jinyu@kaist.ac.kr, Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea, Republic of
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Abstract

A new method of fabricating nanocomposite films made up of multiwall carbon nanotube and nanocrystalline copper was developed by using an electrochemical deposition. The electroplated CNT/Cu nanocomposites have the microstructure that CNTs are well dispersed in both the planar and depth directions without any voids in the matrix. The conditions were successfully achieved by using some amphiphilic polymers, organic additives and a pulse electrodeposition method. The microstructure and CNT composition of nanocomposite films were strongly affected by the concentration of CNT in the electrolyte. The mechanical and electrical properties of CNT/Cu nanocomposite films were investigated with the variation of CNT content in the nanocomposite films.

Keywords

compositenanostructureelectrodeposition
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1056: Symposium HH – Nanophase and Nanocomposite Materials V , 2007 , 1056-HH09-08
Copyright
Copyright © Materials Research Society 2008

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References

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