Hostname: page-component-78c5997874-j824f Total loading time: 0 Render date: 2024-11-13T02:36:59.375Z Has data issue: false hasContentIssue false
  • English
  • Français

Fatigue Properties for Micro-Sized Ni-P Amorphous Alloy Specimens

Published online by Cambridge University Press:  10 February 2011

S. Maekawa ,
K. Takashima ,
M. Shimojo ,
Y Higo  and
M. V Swain
S. Maekawa
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta-cho, Midori-ku, Yokohama 226-8503, Japan, smaekawa@pi.titech.ac.jp
K. Takashima
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta-cho, Midori-ku, Yokohama 226-8503, Japan, smaekawa@pi.titech.ac.jp
M. Shimojo
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta-cho, Midori-ku, Yokohama 226-8503, Japan, smaekawa@pi.titech.ac.jp
Y Higo
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta-cho, Midori-ku, Yokohama 226-8503, Japan, smaekawa@pi.titech.ac.jp
M. V Swain
Affiliation:
University of Sydney, Australian Technology Park, Eveleigh, NSW 1430, Australia
Get access

Abstract

Fatigue crack propagation tests at different stress ratios of 0.1 and 0.5 have been performed on microsized Ni-P amorphous alloy specimens to investigate the influence of stress ratio in the crack growth properties of microsized materials. The specimens tested were cantileverbeam-type with dimensions of 10 × 12 × 50 νm3 prepared by focused ion beam machining. Notches with a depth of 3 [m were introduced in all specimens. The entire set of fatigue tests as performed using a newly developed fatigue testing machine in air at room temperature. Fine stripes deduced to be striations were observed on the fatigue fracture surface. Careful measurements of the striation spacings were made. Fatigue crack propagation rate, that is striation spacing, is plotted as a function stress intensity factor range. Fatigue crack propagation rate at stress-ratios of 0.1 and 0.5 in microsized Ni-P amorphous alloy specimens are given by da/dN ∼ 1.3 × 10−8 ΔK;1.16 and da/dN ∼ 3.7 × 10−8 ΔK0.5, respectively. At a given ΔK, crack propagation rate at a stress ratio of 0.5 was higher than that at 0.1. It is considered that a decrease in crack propagation rate at stress ratio of 0.1 is due to adecrease in effective stress intensity factor range ΔKeff, by the effect of crack closure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 247
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sharpe, W. N. Jr., Yuan, Bin and Edwards, R. L., J. Microelectromech. Syst. 6, 193 (1997).Google Scholar
2. Mencik, J., Quandt, E. and Munz, D., Thin Solid Films 287, 208 (1996).Google Scholar
3. Sato, K., Yoshioka, T., Ando, T., Shikida, M. and Kawabata, T., Sensors & Actuators A: Physical 70, 148 (1998).10.1016/S0924-4247(98)00125-3Google Scholar
4. Takashima, K., Kimura, T., Shimojo, M., Higo, Y., Sugiura, S., Pfister, B. and Swain, M. V., 7th Int. Fatigue Cong., edited by Wu, X. R. and Wang, Z. G. (Higher Education Press, Cradley Heath, UK, 1999), pp. 1871–1876.Google Scholar
5. Takashima, K., Maekawa, S., Shimojo, M., Higo, Y., Sugiura, S. and Swain, M. V, in proc. 1999 Annual Meeting of JSMIE / MMD, edited by Ohtani, R. (Japan Soc. of Mechanical Eng., Tokyo, Japan, 1999), pp 63–64 (in Japanese).Google Scholar
6. Maekawa, S., Takashima, K., Shimojo, M., Higo, Y., Sugiura, S., Pfister, B. and Swain, M. V., Microprocesses and Nanotechnology conf., edited by Horiike, Y. (The Japan Society of Applied Physics, Tokyo, Japan, 1999), pp. 132–133.Google Scholar
7. Maekawa, S., Takashima, K., Shimojo, M., Higo, Y., Sugiura, S. and Swain, M. V., in proc. 1999 Annual Meeting of JSME / ISMAD, edited by Ohtani, R. (Japan Soc. of Mechanical Eng., Tokyo, Japan, 1999), pp 67–68 (in Japanese).Google Scholar
8. Logan, J. and Ashby, M. F., Acta. Met. 22, 1147 (1974).10.1016/0001-6160(74)90030-3Google Scholar
9. Gilbert, C. J. and Richie, R. O., Applied Phys. Lett. 74, 476. (1997)10.1063/1.119610Google Scholar
10. Vormwald, M. and Seeger, T., Fatigue Engin. Mater. Struct. 14, 205 (1991)Google Scholar