No CrossRef data available.
Published online by Cambridge University Press: 21 March 2011
We report about the electrodeposition of a transparent, p-type semiconductor in etched channelsof a thin polyester foil. The embedded semiconductor columns are robust against mechanical stress exerted on the foil, as the soft polyester matrix exerts only small forces on the embedded material. Dissolving the polyester results in freestanding semiconductor columns with height-to-diameter ratios in excess of 100.