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High Precision Silicon Platform Using Self-Alignment Process

Published online by Cambridge University Press:  10 February 2011

S Sakushima ,
K Nakashima ,
Y Masuda ,
S Abe ,
K Takemura  and
M Kyomasu
S Sakushima
Affiliation:
R&D Center, Keihanna, KYOCERA Corp., 3-5 Hikaridai Seikacho Soraku-gun, Kyoto, 619-0237
K Nakashima
Affiliation:
R&D Center, Keihanna, KYOCERA Corp., 3-5 Hikaridai Seikacho Soraku-gun, Kyoto, 619-0237
Y Masuda
Affiliation:
R&D Center, Keihanna, KYOCERA Corp., 3-5 Hikaridai Seikacho Soraku-gun, Kyoto, 619-0237
S Abe
Affiliation:
R&D Center, Keihanna, KYOCERA Corp., 3-5 Hikaridai Seikacho Soraku-gun, Kyoto, 619-0237
K Takemura
Affiliation:
R&D Center, Keihanna, KYOCERA Corp., 3-5 Hikaridai Seikacho Soraku-gun, Kyoto, 619-0237
M Kyomasu
Affiliation:
E/O Products Division, KYOCERA Corp., 2800 Osachi Okaya, Nagano, 394-0011
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Abstract

Silicon platforms were fabricated for optical modules and realize sub-micron precision using self-alignment process. This paper features a self-alignment process and use of precision platforms.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 531: Symposium DD – Reliabilty of Photonics Materials & Structures , 1998 , 375
Copyright
Copyright © Materials Research Society 1998

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References

1. Kendall, D.L., Ann. Rev. Mater. Sci. 1979, 373–403.Google Scholar