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Improved Deposition Process of CVD-(Ba,Sr)TiO3 on Ru
Published online by Cambridge University Press: 21 March 2011
Abstract
(Ba,Sr)TiO3 [BST] films were deposited by the flash vaporization CVD method with a unique liquid delivery system. An inductively coupled plasma mass spectrometry [ICP-MS] analysis revealed the decline of (Ba+Sr)/Ti molar ratio of the initial BST-layer on Ru. By readjusting the flow ratio of liquid sources and using a two-step deposition method, we obtained 30-nm-thick BST films with uniform composition profile, exhibiting good electrical properties. The leakage property, however, was severely deteriorated in BST films less than 24 nm thick. A SEM observation showed the presence of micro-roughness or micro-hillocks in these films, which were confirmed to be caused by Ru oxidation. Therefore, an annealing process of the Ru electrode was added for its planarization, and the CVD process was also improved. As a result, we obtained smooth and finely crystallized ∼ 20-nm-thick BST films with good electrical properties of equivalent SiO2 thickness (teq) ∼ 0.45 nm and leakage current < 1 × 10−7 A/cm2. We also measured properties of BST films deposited on the 3-D Ru electrode. The results are briefly discussed.
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- Copyright © Materials Research Society 2001