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In Vivo Biostability of CVD Silicon Oxide and Silicon Nitride Films

Published online by Cambridge University Press:  01 February 2011

John M. Maloney ,
Sara A. Lipka  and
Samuel P. Baldwin
John M. Maloney
Affiliation:
MicroCHIPS, Inc. 6B Preston Court Bedford, MA 01730
Sara A. Lipka
Affiliation:
MicroCHIPS, Inc. 6B Preston Court Bedford, MA 01730
Samuel P. Baldwin
Affiliation:
MicroCHIPS, Inc. 6B Preston Court Bedford, MA 01730
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Abstract

Low pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD) silicon oxide and silicon nitride films were implanted subcutaneously in a rat model to study in vivo behavior of the films. Silicon chips coated with the films of interest were implanted for up to one year, and film thickness was evaluated by spectrophotometry and sectioning. Dissolution rates were estimated to be 0.33 nm/day for LPCVD silicon nitride, 2.0 nm/day for PECVD silicon nitride, and 3.5 nm/day for PECVD silicon oxide. A similar PECVD silicon oxide dissolution rate was observed on a silicon oxide / silicon nitride / silicon oxide stack that was sectioned by focused ion beam etching. These results provide a biostability reference for designing implantable microfabricated devices that feature exposed ceramic films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 872: Symposium J – Micro- and Nanosystems—Materials and Devices , 2005 , J14.3
Copyright
Copyright © Materials Research Society 2005

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