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Integrated Tribo-Chemical Modeling of Copper CMP

Published online by Cambridge University Press:  31 January 2011

Shantanu Tripathi ,
Seungchoun Choi ,
Fiona M. Doyle  and
David A. Dornfeld
Shantanu Tripathi
Affiliation:
shantanu.tripathi@gmail.com, University of California, Mechanical Engineering, Berkeley, California, United States
Seungchoun Choi
Affiliation:
choisch@berkeley.edu, University of California, Mechanical Engineering, Berkeley, California, United States
Fiona M. Doyle
Affiliation:
fmdoyle@berkeley.edu, University of California, Materials Science and Engineering, 210 Hearst Mining Bldg, Berkeley, California, 94720-1760, United States, 510-643-1666, 510-643-8653
David A. Dornfeld
Affiliation:
dornfeld@me.berkeley.edu, University of California, Mechanical Engineering, Berkeley, California, United States
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Abstract

Copper CMP is a corrosion-wear process, in which mechanical and chemical-electrochemical phenomena interact synergistically. Existing models generally treat copper CMP as a corrosion enhanced wear process. However, the underlying mechanisms suggest that copper CMP would be better modeled as a wear enhanced corrosion process, where intermittent asperity/abrasive action enhances the local oxidation rate, and is followed by time-dependent passivation of copper. In this work an integrated tribo-chemical model of material removal at the asperity/abrasive scale was developed. Abrasive and pad properties, process parameters, and slurry chemistry are all considered. Three important components of this model are the passivation kinetics of copper in CMP slurry chemicals; the mechanical response of protective films on copper; and the interaction frequency of copper with abrasives/pad asperities. The material removal rate during copper CMP was simulated using the tribo-chemical model, using input parameters obtained experimentally in accompanying research or from the literature.

Keywords

Cuoxidationpassivation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1157: Symposium E – Science and Technology of Chemical Mechanical Planarization (CMP) , 2009 , 1157-E02-03
Copyright
Copyright © Materials Research Society 2009

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References

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