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Investigation of Nano-thin β-SiC Layers for Chemical Sensors

Published online by Cambridge University Press:  01 February 2011

Ronak Rahimi
Affiliation:
rrahimi@mix.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
Srikanth Raghavan
Affiliation:
sraghava@mix.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
N.P. Shelton
Affiliation:
nshelton@mix.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
Dinesh Penigalapati
Affiliation:
dpenigal@mix.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
Andrew Balling
Affiliation:
ablanco1@mix.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
Andrew A. Woodworth
Affiliation:
andrew.woodworth@mail.wvu.edu, WVU, Chemical Engineering, PoBox 6102, Morgantown, WV, 26506, United States
Tobias Denig
Affiliation:
tdenig@mix.wvu.edu, WVU, Chemical Engineering, PoBox 6102, Morgantown, WV, 26506, United States
Charter D. Stinespring
Affiliation:
charter.stinespring@mail.wvu.edu, WVU, Chemical Engineering, PoBox 6102, Morgantown, WV, 26506, United States
D. Korakakis
Affiliation:
dimitris.korakakis@mail.wvu.edu, WVU, Lane Department of Computer Science and Electrical Engineering, PoBox 6109, Morgantown, WV, 26506, United States
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Abstract

Silicon Carbide possesses a combination of properties that make it ideal for use in electronics. Its high values of electric breakdown field, melting point and saturated electron drift velocity have attracted the attention of the semiconductor community. Although the interest in β-SiC/Si devices has intensified in recent years [1-2], little focus has been given to the study of nano-thin film devices. Monocrystalline nano-thin β-SiC films have been reproducibly grown on Si (100) by Gas Source Molecular Beam Epitaxy (GSMBE). Auger Electron Spectroscopy and Reflection High Energy Electron Diffraction characterization have confirmed a growth consistent of β-SiC/Si. Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM) characterization has determined film thicknesses of 30nm. These nano-films have been used in the fabrication of Metal-Semiconductor-Metal (MSM) devices formed from aluminum Schottky contacts. Under electrical characterization, these MSM devices have exhibited unique properties in that the dominant conduction path does not occur at the β-SiC/Si interface [3] as previously reported, but within the entire β-SiC layer. It is proposed that the device is isolated from the Silicon substrate and due to the nano-thin β-SiC films used in this work the differentiation between surface and ‘bulk’ is not clear. Results obtained through chemical experimentation have indicated that conduction is largely dependent on the surface condition of the device. This suggests the possibility for nano-thin, surface-like, β-SiC films to be used in chemical agent sensors.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1. Azevedo, R.G, Jones, D.G, Jog, A.V, Jamshidi, B., Myers, D.R, Chen, L., Fu, X., Mehregany, M., Wijesundara, M.B, Pisano, A.P, IEEE Sens. J. 7, 801803 (2007).Google Scholar
2. Young, D.J, Du, J., Zorman, C.A, Ko, W.H, IEEE Sens. J. 4, 464470 (2004).Google Scholar
3. Hsieh, W.T, Fang, Y.K, Wu, K.H, Lee, W.J, Ho, J.J, Ho, C.W, IEEE Trans. Electron Devices 48, 801803 (2001).Google Scholar
4. Davis, R.F, Kelner, G., Shur, M., Palmour, J.W, Edmond, J.A, Proc. of the IEEE 79, 677701 (1991).Google Scholar
5. Sasaki, K., Sakuma, E., Misawa, S., Yoshida, S., Gonda, S., Appl. Phys. Lett 45, 7273 (1984).Google Scholar
6. Zhang, Z.Y, Jin, C.H, Liang, X.L, Chen, Q., Peng, L.M, Appl. Phys. Lett. 88, 073102 (2006).Google Scholar
7. Peng, C.Y, Woodworth, A.A, Ziemer, K.S, and Stinespring, C.D, Method for Rapid Determination of Ion Gauge Sensitivity Factors, To Appear - Review of Scientific Instruments.Google Scholar
8. Ziemer, K.S, Woodworth, A.A, Peng, C.Y, and Stinespring, C.D, Diamond and Related Materials 16, 486493 (2007).Google Scholar
9. Stinespring, C.D and Wormhoudt, J.C, J. Appl. Phys. 65, 1733–42 (1989).Google Scholar
10. SiC lattice constant- “Handbook of Chemistry and Physics” 53rd edition 1972-1973.Google Scholar
11. Mori, M., IEEE Trans. Electron Devices 30, 8186 (1983).Google Scholar
12. Porter, L.M, Davis, R.F, Mater. Sci. Eng., 83105 (1995).Google Scholar
13. Basu, S., Roy, S., Laha, R., Jacob, C., Nishino, S., COMMAD, Proc. Conf. 6–8, 328331 (2000).Google Scholar
14. Sze, S.M, “Metal-Semiconductor Contacts” Physics of Semiconductor Devices New York: John Wiley & Sons, (1981).Google Scholar
15. Fawcett, , Timothy, J., Wolan, , John, T., Myers, , Saddow, , , S.E., Appl. Phys. Lett. 85, 416418 (2004).Google Scholar
16. Pearton, S.J, Kang, B.S, Kim, S., Ren, F., J. Phys. Condens. Matter 16, 961 (2004).Google Scholar
17. Scholz, R., Gosele, U., Wischmeyer, F., Niemann, E., Appl. Phys. A 66, 5967 (1997).Google Scholar
18. Bumgarner, , Kong, H.S, Kim, H.J, Palmour, J.W, Edmond, J.A, Glass, J.T, Davis, R.F, Thin Solid Films 181, 115 (1989).Google Scholar