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Low Temperature Direct Metal Bonding by Self Assembled Monolayers

Published online by Cambridge University Press:  01 February 2011

Xiaofang Ang ,
Li Cheong Chin ,
Guo Ge Zhang ,
Jun Wei ,
Zhong Chen  and
Chee Cheong Wong
Xiaofang Ang
Affiliation:
angx0004@ntu.edu.sg, School of Materials Science & Engineering,Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North Block N4.1, Level B3,Rm N4.1-B3-02, Singapore, 639798, Singapore, +65-67906161, +65-67909081
Li Cheong Chin
Affiliation:
xiaojun_chin@hotmail.com, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Guo Ge Zhang
Affiliation:
Guoge.Zhang@Honeywell.com, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Jun Wei
Affiliation:
jwei@SIMTech.a-star.edu.sg, Singapore Institute of Manufacturing Technology, Micro-Joining and Substrate Technology, Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore
Zhong Chen
Affiliation:
ASZChen@ntu.edu.sg, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
Chee Cheong Wong
Affiliation:
WongCC@ntu.edu.sg, School of Materials Science & Engineering, Nanyang Technological University, Division of Materials Technology, 50 Nanyang Ave, Academic Complex North N4.1, Singapore, 639798, Singapore
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Abstract

Elevated bonding temperature for interconnection deteriorates the reliability of both the device and the interconnect; hence the imperative for developing low temperature bonding methods. This study investigates the feasibility of using self-assembled monolayers (SAMs) to assist direct gold-gold bonding. This involves a simple molecular self-assembly process whereby a monolayer of alkyl chains with a sulfur end group is attached to the gold surface prior to thermocompression bonding. Using this method, we have achieved gold to gold bonding at a bonding temperature below 100°C, a significant reduction compared to the conventional bonding temperatures of above 150 °C. We attribute this temperature reduction to two properties of SAMs - (1) surface passivation of the Au surface that precludes adsorption of surface contaminants, and (2) The easy displacement of SAMs through thermal desorption just before bonding occurs. This SAMs-assisted bonding mechanism is supported by X-ray photoelectron spectroscopy (XPS) and surface plasmon resonance (SPR) results.

Keywords

self-assemblybondingpassivation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B10-03
Copyright
Copyright © Materials Research Society 2007

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References

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