Hostname: page-component-cd9895bd7-dk4vv Total loading time: 0 Render date: 2025-01-01T04:35:05.792Z Has data issue: false hasContentIssue false
  • English
  • Français

MEMS Material Microstructure and Elastic Property Modeling

Published online by Cambridge University Press:  10 February 2011

Howard R. Last ,
Kevin J. Hemker  and
Ronald Witt
Howard R. Last
Affiliation:
Underwater Warheads Technology & Development Dept., Naval Surface Warfare Center, Indian Head, MD 20640, lasthr@ih.navy.mil
Kevin J. Hemker
Affiliation:
Dept. of Mechanical Engineering, The Johns Hopkins University, Baltimore, MD
Ronald Witt
Affiliation:
TexSEM Laboratories, Inc., Draper, UT
Get access

Abstract

Results from initial efforts to develop a quantitative understanding of the material microstructure – elastic properties relationship for electroplated LIGA nickel will be presented. Microsample tensile testing and microstructural characterization results including grain size and grain orientation measurements obtained using orientation imaging microscopy (OIM) are discussed. The use of these data in the development of a finite element modeling approach to represent the mechanical response of “meso-scale” LIGA nickel MEMS material will be highlighted.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 191
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Schweitz, Jan-Åke, MRS Bulletin, 17 (7), 34–45, (1992).Google Scholar
2. Tai, Y-C and Muller, R.S., Proc. IEEE Micro Electro Mechanical Systems, Napa Valley, CA, 147–152, (1990).Google Scholar
3. Weihs, T.P., et al. , J. Mater. Res., 3 (5), 931–942, (1988).Google Scholar
4. Sharpe, W.M., et al. , Proc. Transducers '97 IEEE, Chicago, IL 607–610, (1997).Google Scholar
5. Tsuchiya, T., et al. , J. Microelectromechanical Systems, 7 (1), 106–113, (1998).10.1109/84.661392Google Scholar
6. Sharpe, W.N., et al. , MRS Symposium Proc., 518, 57–66, (1998).Google Scholar
7. Christenson, T.R., et al. , MRS Symposium Proc., 518, 185–190, (1998).10.1557/PROC-518-185Google Scholar
8. Sharpe, W.N. and McAleavey, A., Proc. SPIE, 3512, 130–137 (1998).Google Scholar
9. Xie, Z.L., et al. , these proceedings.Google Scholar
10. Lee, S., et al. , MRS Symposium Proc., 518, 21–26, (1998).Google Scholar
11. Jayaraman, S., et al. , J. Mater. Res., 14, (3), 688–697 (1999).Google Scholar
12. Fan, L., et al. , Microsystems Tech., 4 (4), 168–171, (1998).Google Scholar
13. Wright, S.I., J. Computer-Assisted Microscopy, 5 (3), 207–221, 1993.Google Scholar
14. Adams, B.L., et al. , Met. Trans. A, 24A (4), 819–831, 1993.Google Scholar