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Optimization of Thermoelectric Properties of Ni-Cu based Alloy through Combinatorial Approach

Published online by Cambridge University Press:  01 February 2011

Atsushi Yamamoto ,
Haruhiko Obara  and
Kazuo Ueno
Atsushi Yamamoto
Affiliation:
a.yamamoto@aist.go.jp, National Institute of Advanced Industrial Science and Technology (AIST), Energy Technology Research Institute, Umezono 1-1-1, Tsukuba, 3058568, Japan, +81-2986115776, +81-2986115340
Haruhiko Obara
Affiliation:
h.obara@aist.go.jp, National Institute of Advanced Industrial Science and Technology (AIST), Energy Technology Research Institute, Umezono 1-1-1, Tsukuba, 3058568, Japan
Kazuo Ueno
Affiliation:
ueno.kazuo@aist.go.jp, National Institute of Advanced Industrial Science and Technology (AIST), Energy Technology Research Institute, Umezono 1-1-1, Tsukuba, 3058568, Japan
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Abstract

The thermoelectric properties of Ni1-xCux (0<x<1) alloy are measured from 323K to 950K. The sample with optimized composition, Ni70Cu30 is found to possess large power factor value of 0.012 Wm−1K−2 at around 950K. Estimated figure of merit value ZT is 0.21 for Ni50Cu50 and 0.18 for Ni70Cu30 at the same temperature. A novel attempt of high-throughput parallel synthesis using multiple-wells is carried out to test the feasibility of combinatorial approach in this material system. The Seebeck coefficient is visualized over the multiple-wells combinatorial library and the other Ni-Cu composition-spread, and it is proved that further enhancement of throughput could be possible by conducting systematic experiments based on the combinatorial approaches performed in this study.

Keywords

thermoelectricityalloyelectron-phonon interactions
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1044: Symposium U – Thermoelectric Power Generation , 2007 , 1044-U06-18
Copyright
Copyright © Materials Research Society 2008

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References

1. Echigo, R., Hanamura, K., Yoshida, H., Koda, M., and Tawata, K., Proc. 11th Int. Conf. on Themroelectrics, (1992) 45.Google Scholar
2. Yamamoto, A., Proc. 23th Int. Conf. on Themroelectrics, (2004) #39. in CD-ROM.Google Scholar
3. Yamamoto, A., Proc. MRS Proceedings No.804 (2004) pp.3–14.Google Scholar
4. Yamamoto, A., Lee, C.H., Takazawa, H., Ohta, T., Ueno, K., Aizawa, T. and Fukagawa, H., Proc. FGM2000, (2001) p.119.Google Scholar
5. Yamamoto, A., Takazawa, H., Lee, C.H., and Ohta, T., Proc. FGM2001, (2002) p.7.Google Scholar