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Preparation Of Moisture Resistant Polylmide Films By Plasma Treatment

Published online by Cambridge University Press:  15 February 2011

Mark A. Petrich  and
Hsueh Yi Lu
Mark A. Petrich
Affiliation:
Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208
Hsueh Yi Lu
Affiliation:
Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208
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Abstract

Polyimides are an important class of polymeric materials used in microelectronics fabrication. These polymers could be used even more extensively if it were possible to improve their moisture resistance. We are using plasma processing techniques to modify the moisture resistance of polyimide films. Films are exposed to nitrogen trifluoride plasmas to introduce fluorine into the surface of the polyimide. Fluorination is monitored with x-ray photoelectron spectroscopy and Fourier transform infrared absorption spectroscopy. Water contact angle measurements are used to assess the hydrophobicity of the treated surfaces. Thus far, we have demonstrated that this plasma treatment is a good way of introducing fluorine into the polyimide surface, and that these treatments do enhance the hydrophobic nature of polyimide.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 323
Copyright
Copyright © Materials Research Society 1991

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References

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