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Real Time Study of Cu Diffusion through a Ru Thin Film by Photoemission Electron Microscopy (PEEM)

Published online by Cambridge University Press:  01 February 2011

Wayne P. Hess ,
Gang Xiong ,
Y.-M. Sun ,
Alan G. Joly ,
Kenneth M. Beck ,
J. M. White  and
Wayne P. Hess
Wayne P. Hess
Affiliation:
wayne.hess@pnl.gov, Pacific Northwest National Laboratory, Chemical Structure and Dynamics, P. O. Box 999, Richland, WA 99352, USA, Richland, WA, 99352, United States
Gang Xiong
Affiliation:
gang.xiong@pnl.gov, Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
Y.-M. Sun
Affiliation:
yangming@mail.utexas.edu, The University of Texas at Austin, Department of Chemistry and Biochemistry, Austin, TX, 78712, United States
Alan G. Joly
Affiliation:
agjoly@pnl.gov, Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
Kenneth M. Beck
Affiliation:
kenneth.beck@pnl.gov, Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
J. M. White
Affiliation:
jmwhite@mail.utexas.edu, The University of Texas at Austin, Department of Chemistry and Biochemistry, Austin, TX, 78712, United States
Wayne P. Hess
Affiliation:
wayne.hess@pnl.gov, Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
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Abstract

We demonstrate the efficacy of Photoemission Electron Microscopy (PEEM) as a tool to detect metal diffusion processes at nanoscale spatial resolution in real time. For a sample comprising a nominally 1 nm physical vapor-deposited (PVD) Ru thin film covering a thick Cu substrate, we have observed the appearance of bright features on a dark background as the temperature is monotonically increased and irradiated with photons from a Hg arc lamp. These bright features are the result of a lower work function due to Cu diffusion through the Ru film.

Keywords

diffusionCuphotoemission
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F05-07
Copyright
Copyright © Materials Research Society 2006

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References

1 Gunther, S., Kaulich, B., Gregoratti, L., and Kiskinova, M., Prog. Surf. Sci. 70, 187 (2002).Google Scholar
2 Sweich, W., Fecher, G. H., Ziethen, C., Schonhense, G., Grzelakowski, K., Schneide, C. M., Fromter, R., Oepen, H. P., and Kirschner, J., J. Electron Spectrosc. Relat. Phenom. 84, 171 (1997).Google Scholar
3 Ballarotto, V. W., Breban, M., Siegrist, K., Phaneuf, R. J., and Williams, E. D., J. Vac. Sci. Technol. B 20, 2514 (2002).Google Scholar
4 Siegrist, K., Ballarotto, V. W., Breban, M., Youngsunthon, R., and Williams, E. D., Appl. Phys. Lett. 84, 1419 (2004).Google Scholar
5 Cai, M., Langford, S. C., Dickinson, J. T., Huang, W. M., He, Q., Droubay, T. C., and Baer, D. R., Proceedings of ICMEM2005 (International Conference on Mechanical Engineering and Mechanics), 1123–1127 (2005).Google Scholar
6 Leung, T. C., Kao, C. L., Su, W. S., Feng, Y. J., and Chan, C. T., Phys. Rev. B 68, 195408 (2003).Google Scholar
7 Yang, W.-C., Rodriguez, B. J., Gruverman, A., and Nemanich, R. J., J. Phys.: Condense. Matter 17, S1415–S1426 (2005).Google Scholar
8 Xiong, G., Joly, A. G., Beck, K. M., Hess, W. P., Cai, M., Langford, S. C., and Dickinson, J. T., Appl. Phys. Lett. 88, 091910 (2006).Google Scholar
9 Chan, R., Arunagiri, T. N., Zhang, Y., Chyan, O., Wallace, R. M., Kim, M. J., and Hurdc, T. Q., Electrochem. Solid-State Lett. 7, G154 (2004).Google Scholar
10 Chyan, O., Arunagiri, T. N., and Panuswamy, T., J. Electrochem. Soc. 150, C347 (2003).Google Scholar
11 Binary Alloy Phase Diagrams, edited by Massalski, T. B., 2nd ed. American Society of Metals, Materials Park, OH, 1990, p. 1467.Google Scholar
12 Arunagiri, T. N., Zhang, Y., Chyan, O., Kim, M. J. and Hurd, T. Q., J. Electrochem. Soc., 152, G808 (2005).Google Scholar
13 http://www.nist.gov/srd/nist71.htmGoogle Scholar
14 ELMITEC Elektronenmikroskopie GmbH, http://www.elmitec.de/.Google Scholar
15 Bottcher, A., Krenzer, B., Conrad, H. and Niehus, H., Surf. Sci. 504, 42 (2004).Google Scholar
16 Michaelson, H. B., J. App. Phys. 48, 4729 (1977).Google Scholar
17 Singer, P., Semicond. Int., 40, 27 (2004).Google Scholar
18 Peters, L., Semicond. Int., 26, 50 (2003).Google Scholar