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Significance of Surface Topography on Performance and Lifetime of MEMS Switches and Relays

Published online by Cambridge University Press:  01 February 2011

Lior Kogut
Affiliation:
Department of Mechanical Engineering, University of California, Berkeley, CA 94720
Kyriakos Komvopoulos
Affiliation:
Department of Mechanical Engineering, University of California, Berkeley, CA 94720
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Abstract

Switches and relays that have emerged from the microelectromechanical systems (MEMS) technology have the potential to replace traditional solid-state devices due to broader operating temperature range, higher breakdown voltage, and much higher off-state resistance. Interest in MEMS switches and relays has surged recently, principally due to the demonstrated performance in switching radio-frequency signals. However, understanding of the effect of the surface topography on performance and lifetime of these microdevices is rather empirical. Therefore, the objective of this study was to explore the role of surface topography in various physical phenomena encountered at contact interfaces of MEMS switches and relays. Emphasis is given on the dependence of pull-in voltage, electric field, and electrical breakdown on surface topography and interpretation of contact interface phenomena associated with surface erosion and adhesion in the context of surface topography effects. In addition, current obstacles in the study of the influence of the surface topography on the performance of MEMS switches and relays are discussed in light of recent findings.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

1 Petersen, K., IBM Res. Develop. 23, 376 (1979).Google Scholar
2 Brown, E. R., IEEE Trans. Microwave Theory and Techniques 46, 1868 (1998).Google Scholar
3 Yao, J. J., J. Micromech. Microeng. 10, R9 (2000).Google Scholar
4 Tilmans, H. A. C., Raedt, W. De and Beyne, E., J. Micromech. Microeng. 13, S139 (2003).Google Scholar
5 Lucyszyn, S., IEEE Proc. Sci. Measur. Technol. 151, 93 (2004).Google Scholar
6 Li, Z., Zhang, D., Li, T., Wang, W. and Wu, G., J. Micromech. Microeng. 10, 329 (2000).Google Scholar
7 Kruglick, E. J. J. and Pister, K. S. J., J. Microelectromech. Syst. 8, 264 (1999).Google Scholar
8 Peroulis, D., Pacheco, S. P., Sarabandi, K. and Katehi, L. P. B., IEEE Trans. Microwave Theory and Techniques 51, 259 (2003).Google Scholar
9 Goldsmith, C., Ehmke, J., Malczewski, A., Pillans, B., Eshelman, S., Yao, Z., Brank, J. and Eberly, M., in Proc. IEEE MTT-S 2001 International Microwave Symposium Digest 1, 227.Google Scholar
10 Pamidighantam, S., Puers, R., Baert, K. and Tilmans, H. A. C., J. Micromech. Microeng. 12, 458 (2002).Google Scholar
11 Patrikar, R. M., Appl. Sur. Sci. 228, 213 (2004).Google Scholar
12 Paik, S.-J., Y. Park snd Cho, D.-I., J. Micromech. Microeng. 13, 373 (2003).Google Scholar
13 Torres, J.-M. and Dhariwal, R. S., Microsys. Technol. 6, 6 (1999).Google Scholar
14 Davies, D. K. and Biondi, M. A., J. Appl. Phys. 37, 2969 (1996).Google Scholar
15 Williams, D. W. and Williams, W. T., J. Phys. D 5, 1845 (1972).Google Scholar
16 Slade, P. G. and Taylor, E. D., IEEE Trans. Comp. Pack. Technol. 25, 390 (2002).Google Scholar
17 Torres, J.-M. and Dhariwal, R. S., Nanotechnol. 10, 102 (1999).Google Scholar
18 Ono, T., Sim, D. Y. and Esashi, M., J. Micromech. Microeng. 10, 445 (2000).Google Scholar
19 Lee, S., Ramadoss, R., Buck, M., Bright, V. M., Gupta, K. C. and Lee, Y. C., Microelect. Reliab. 44, 245 (2004).Google Scholar
20 Wibbeler, J., Pfeifer, G., G. and Hietschold, M., Sensors Actuators A 71, 74 (1998).Google Scholar
21 Chan, E. K., Garikipati, K., and Dutton, R. W., J. Microelectromech. Syst. 8, 208 (1999).Google Scholar
22 Hill, M., O'Mahony, C., Duane, R. and Mathewson, A., J. Micromech. Microeng. 13, S131 (2003).Google Scholar