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Structuring of Low Firing Temperature PZT Thick Films by Photolithography

Published online by Cambridge University Press:  01 February 2011

Stefan Schimpf  and
Bertram Schmidt
Stefan Schimpf
Affiliation:
stefan.schimpf@et.uni-magdeburg.de, Otto-von-Guericke-University Magdeburg, IMOS, PO Box 4120, Magdeburg, Sachsen-Anhalt, 39016, Germany
Bertram Schmidt
Affiliation:
bertram.schmidt@e-technik.uni-magdeburg.de, Otto-von-Guericke University, IMOS, PO Box 4120, Magdeburg, Sachsen-Anhalt, 39016, Germany
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Abstract

Structured piezoelectric PZT thick films were fabricated on silicon wafers. Different supplements, like lead oxide and glasses, were added to the PZT to enhance the sintering. The films were structured by doctor blading on an epoxy based photoresist mask. This allows very accurate micro patterns of high quality piezoelectric material. A firing process was developed to gain PZT structures with 200 μm in lateral size and a 200 μm pitch. The structures were electrically contacted, poled and characterized.

Keywords

piezoelectricceramicmicroelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 928: Symposium GG – Current and Future Trends of Functional Oxide Films , 2006 , 0928-GG09-18
Copyright
Copyright © Materials Research Society 2006

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